99
Boxed Processor Specifications
8
Boxed Processor Specifications
8.1
Introduction
Intel boxed processors are intended for system integrators who build systems from
components available through distribution channels. The Dual-Core Intel® Xeon®
Processor 5200 Series will be offered as an Intel boxed processor.
Intel will offer the Dual-Core Intel® Xeon® Processor 5200 Series with two heat sink
configurations available for each processor frequency: 1U passive/3U+ active
combination solution and a 2U passive only solution. The 1U passive/3U+ active
combination solution is based on a 1U passive heat sink with a removable fan that will
be pre-attached at shipping. This heat sink solution is intended to be used as either a
1U passive heat sink, or a 3U+ active heat sink. Although the active combination
solution with removable fan mechanically fits into a 2U keepout, its use is not
recommended in that configuration.
Dual-Core Intel® Xeon® Processor X5200 Series will include a copper 1U passive/3U+
active combination solution or a copper 2U passive heatsink. The Dual-Core Intel®
Xeon® Processor E5200 Series and Dual-Core Intel® Xeon® Processor L5200 Series
with 65W and lower TDPs will include an aluminum extruded 1U passive/3U+ active
combination solution or an aluminum extruded 2U passive heatsink.
The 1U passive/3U+ active combination solution in the active fan configuration is
primarily designed to be used in a pedestal chassis where sufficient air inlet space is
present and strong side directional airflow is not an issue. The 1U passive/3U+ active
combination solution with the fan removed and the 2U passive thermal solution require
the use of chassis ducting and are targeted for use in rack mount or pedestal servers.
The retention solution used for these products is called the Common Enabling Kit, or
CEK. The CEK base is compatible with both thermal solutions and uses the same hole
locations as the Intel
®
Xeon
®
processor with 800 MHz system bus.
The 1U passive/3U+ active combination solution will utilize a removable fan capable of
4-pin pulse width modulated (PWM) control. Use of a 4-pin PWM controlled active
thermal solution helps customers meet acoustic targets in pedestal platforms through
the motherboards’s ability to directly control the RPM of the processor heat sink fan.
See
Section 8.3
for more details on fan speed control, and see
Section 6.3
for more on
the PWM and PECI interface along with Digital Thermal Sensors (DTS).
Figure 8-1
through
Figure 8-3
are representations of the two heat sink solutions.
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Страница 1: ...318590 005 Dual Core Intel Xeon Processor 5200 Series Datasheet August 2008...
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Страница 41: ...41 Mechanical Specifications Figure 3 3 Dual Core Intel Xeon Processor 5200 Series Package Drawing Sheet 2 of 3...
Страница 42: ...Mechanical Specifications 42 Figure 3 4 Dual Core Intel Xeon Processor 5200 Series Package Drawing Sheet 3 of 3...
Страница 92: ...Thermal Specifications 92...
Страница 98: ...Features 98...
Страница 102: ...Boxed Processor Specifications 102 Figure 8 4 Top Side Board Keepout Zones Part 1...
Страница 103: ...103 Boxed Processor Specifications Figure 8 5 Top Side Board Keepout Zones Part 2...
Страница 104: ...Boxed Processor Specifications 104 Figure 8 6 Bottom Side Board Keepout Zones...
Страница 105: ...105 Boxed Processor Specifications Figure 8 7 Board Mounting Hole Keepout Zones...
Страница 106: ...Boxed Processor Specifications 106 Figure 8 8 Volumetric Height Keep Ins...
Страница 107: ...107 Boxed Processor Specifications Figure 8 9 4 Pin Fan Cable Connector For Active CEK Heat Sink...
Страница 108: ...Boxed Processor Specifications 108 Figure 8 10 4 Pin Base Board Fan Header For Active CEK Heat Sink...
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