LGA1156 Socket
24
Thermal/Mechanical Specifications and Design Guidelines
3.6
Markings
There are three markings on the socket:
• LGA1156: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
All markings must withstand 260°C for 40 seconds (typical reflow/rework profile)
without degrading, and must be visible after the socket is mounted on the
motherboard.
LGA1156 and the manufacturer's insignia are molded or laser marked on the side wall.
3.7
Component Insertion Forces
Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/
Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table
R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force
to insert the package into the socket.
3.8
Socket Size
Socket information needed for motherboard design is given in
This information should be used in conjunction with the reference motherboard keep-
out drawings provided in
to ensure compatibility with the reference thermal
mechanical components.
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Содержание i5-700
Страница 30: ...Independent Loading Mechanism ILM 30 Thermal Mechanical Specifications and Design Guidelines...
Страница 88: ...Mechanical Drawings 88 Thermal Mechanical Specifications and Design Guidelines...
Страница 94: ...Socket Mechanical Drawings 94 Thermal Mechanical Specifications and Design Guidelines...
Страница 98: ...Package Mechanical Drawings 98 Thermal Mechanical Specifications and Design Guidelines...
Страница 102: ...Heat Sink Back Plate Drawings 102 Thermal Mechanical Specifications and Design Guidelines...
