Intel i5-700, Технические характеристики

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Mechanical Drawings
78 Thermal/Mechanical Specifications and Design Guidelines
Figure B-3. Socket / Processor / ILM Keepout Zone Primary Side (Top)
A
A
B
B
DEPARTMENT
R
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
PST-TMI
TITLE
LGA1156 & 1155 SOCKET, ILM & PROCESSOR KEEPIN
SIZE
DRAWING NUMBER
REV
A1
E21320
J
SCALE:
1.000
DO NOT SCALE DRAWING
SHEET
1
OF
2
51.00
70.37
17.00
7
170.0
()15.16
8.12
49.50
3.75
11.75
9.26
9.26
8.97
8.97
6.55
3X
6.34
6.76 6.76 1.25
13.00
5.50
40.71 37.54
()78.25
CLEARANCE NEEDED FOR WIRE TRAVEL 3.75
4.00
8
130.0
6
18.72
6
27.33
3.18 3.18
15.92
19.50
()42.50
()42.50
4.00
1.75
7.00
() TYP PCB THICKNESS
1.50
2.50
()49.50
2.50
2
8.12
42.50
21.25
()94.76
78.25
3X
2.58
3X
5.00
12.29
19.99
B
C
C
B
B
C
C
(R
)
65.21
(R
)
46.51
()37.54
()2.50
()1.50
NOTES:
1
SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC
CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE (ALIGNS WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP-INS).
2
SOCKET KEEP-IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET
AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSITION. IT ENCOMPASSES SOCKET AND CPU PACKAGE DIMENSIONAL TOLERANCES AND DEFLECTION / SHAPE CHANGES DUE TO ILM LOAD. 3. SOCKET KEEP-IN VOLUME ENCOMPASS THE SOCKET NOMINAL VOLUME AND ALLOWANCES FOR SIZE TOLERANCES. THERMAL/MECHANICAL COMPONENT DEVELOPERS SHALL DESIGN TO THE OUTSIDE OF SOCKET KEEP IN VOLUME WITH CLEARANCE MARGINS. SOCKET DEVELOPERS SHALL DESIGN TO THE INSIDE VOLUME. 4.DIMENSIONS ARE IN MILLIMETERS
5
NO COMPONENT BOUNDARY-FINGER ACCESS AREA
6
MOTHERBOARD BACKSIDE COMPONENT KEEP-IN
7
MAXIMUM OPEN ANGLE TO OPEN LOAD PLATE
8
MINIMUM OPEN ANGLE TO CLEAR LOAD PLATE
TOP SIDE
BOTTOM SIDE
1
2
SECTION A-A
SECTION B-B
SEE DETAIL
A
5
MAX LEVER MOTION SPACE
TO LEVER STOP
7
LOAD PLATE OPENING MOTION SPACE
MIN LEVER MOTION SPACE
TO OPEN LID
8
PRIMARY SIDE COMPONENT CLEARANCE
LEVER UNLATCHED
POSITION
SECONDARY SIDE COMPONENT CLEARANCE
SEE DETAIL
A