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Thermal/Mechanical Specifications and Design Guidelines

LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications

LGA1156 Socket and ILM

Electrical, Mechanical, and

Environmental Specifications

This chapter describes the electrical, mechanical, and environmental specifications for
the LGA1156 socket and the Independent Loading Mechanism.

5.1

Component Mass

5.2

Package/Socket Stackup Height

Table 5-2

provides the stackup height of a processor in the 1156-land LGA package and

LGA1156 socket with the ILM closed and the processor fully seated in the socket.

Notes:

This data is provided for information only, and should be derived from: (a) the height of the socket seating

plane above the motherboard after reflow, given in

Appendix C

, (b) the height of the package, from the

package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that

are given in the corresponding processor datasheet.

The integrated stackup height value is a RSS calculation based on current and planned processors that will

use the ILM design.

Table 5-1.

Socket Component Mass

Component

Mass

Socket Body, Contacts and PnP Cover

10 g

ILM Cover

29 g

ILM Back Plate

38 g

Table 5-2.

1156-land Package and LGA1156 Socket Stackup Height

Component

Stackup Height

Note

Integrated Stackup Height

(mm)

From Top of Board to Top of IHS

7.781 ± 0.335 mm

Socket Nominal Seating Plane Height

3.4 ± 0.2 mm

Package Nominal Thickness (lands to top of IHS)

4.381 ± 0.269 mm

Содержание i5-700

Страница 1: ...Document Number 322167 002 Intel Core i7 800 and i5 700 Desktop Processor Series and LGA1156 Socket Thermal Mechanical Specifications and Design Guidelines September 2009...

Страница 2: ...to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel rese...

Страница 3: ...ace Cover 21 3 4 Package Installation Removal 22 3 4 1 Socket Standoffs and Package Seating Plane 23 3 5 Durability 23 3 6 Markings 24 3 7 Component Insertion Forces 24 3 8 Socket Size 24 4 Independen...

Страница 4: ...tion 58 8 ATX Reference Thermal Solution 59 8 1 Heatsink Thermal Solution 59 8 2 Geometric Envelope for the Intel Reference ATX Thermal Mechanical Design 60 8 3 Heatsink Mass and Center of Gravity 60...

Страница 5: ...ance versus Fan Speed 53 7 6 Fan Response Without TAMBIENT Data 55 7 7 Fan Response with TAMBIENT Aware FSC 56 8 1 ATX Heatsink Reference Design Assembly 59 8 2 ATX KOZ 3 D Model Primary Top Side 60 1...

Страница 6: ...Drawing Sheet 2 of 4 91 C 3 Socket Mechanical Drawing Sheet 3 of 4 92 C 4 Socket Mechanical Drawing Sheet 4 of 4 93 D 1 Processor Package Drawing Sheet 1 of 2 96 D 2 Processor Package Drawing Sheet 2...

Страница 7: ...800 and i5 700 Desktop Processor Series 38 6 3 Thermal Solution Performance above TCONTROL for the Intel Core i7 800 and i5 700 Desktop Processor Series 39 6 4 Supported PECI Command Functions and Co...

Страница 8: ...al Specifications and Design Guidelines Revision History Revision Number Description Revision Date 001 Initial release September 2009 002 Updated Tables A 2 and A 3 Updated Chapters 3 4 8 and Appendix...

Страница 9: ...s Material and concepts available in the following documents may be beneficial when reading this document Table 1 1 Reference Documents Document Location Intel Core i7 800 and i5 700 Desktop Processor...

Страница 10: ...d as TCASE TS Total Package Power SA Sink to ambient thermal characterization parameter A measure of heatsink thermal performance using total package power Defined as TS TLA Total Package Power TCASE...

Страница 11: ...es as the mating surface for processor thermal solutions such as a heatsink Figure 2 1 shows a sketch of the processor package components and how they are assembled together Refer to Chapter 3 and Cha...

Страница 12: ...nt keep out dimensions 5 Reference datums 6 All drawing dimensions are in mm 2 1 2 Processor Component Keep Out Zones The processor may contain components on the substrate that define component keep o...

Страница 13: ...ckage Handling Guidelines Table 2 2 includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate These package handling...

Страница 14: ...Component Material Integrated Heat Spreader IHS Nickel Plated Copper Substrate Fiber Reinforced Resin Substrate Lands Gold Plated Copper Figure 2 3 Processor Top Side Markings Legend GRP1LINE1 GRP1LIN...

Страница 15: ...oordinates Figure 2 4 shows the bottom view of the processor package Figure 2 4 Processor Package Lands Coordinates AY AV AT AP AM AK AH AF AD AB Y V T P M K H F D B AW AU AR AN AL AJ AG AE AC AA W U...

Страница 16: ...given as an example only Non Operating Temperature Limit 40 C to 70 C Humidity 50 to 90 non condensing with a maximum wet bulb of 28 C Post board attach storage temperature limits are not specified f...

Страница 17: ...surface mounting on the motherboard The contacts are arranged in two opposing L shaped patterns within the grid array The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the arr...

Страница 18: ...3 7 5 9 11 15 13 17 19 23 21 25 27 29 2 8 4 6 10 16 12 14 18 24 20 22 26 28 30 15 11 13 17 23 19 21 25 31 27 29 33 39 35 37 32 14 12 16 18 22 20 24 26 30 28 34 38 36 40 A C E G J L N R U W AA AC AE AG...

Страница 19: ...W AA AC AE AG AJ AL AN AR AU AW B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY 1 3 7 5 9 11 15 13 17 19 23 21 25 27 29 2 8 4 6 10 16 12 14 18 24 20 22 26 28 30 32 15 11 14 12 13 16 17 23 19 18 22 2...

Страница 20: ...l assembly Refer to Appendix C for detailed drawings 3 3 1 Socket Body Housing The housing material is thermoplastic or equivalent with UL 94 V 0 flame rating capable of withstanding 260 C for 40 seco...

Страница 21: ...e contact area is allowed during solder reflow 3 3 4 Pick and Place Cover The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology SMT manufactur...

Страница 22: ...ual reference for proper orientation The package substrate has orientation notches along two opposing edges of the package offset from the centerline The socket has two corresponding orientation posts...

Страница 23: ...the minimum package height See Section 5 2 for the calculated IHS height above the motherboard 3 5 Durability The socket must withstand 20 cycles of processor insertion and removal The max chain conta...

Страница 24: ...erboard LGA1156 and the manufacturer s insignia are molded or laser marked on the side wall 3 7 Component Insertion Forces Any actuation must meet or exceed SEMI S8 95 Safety Guidelines for Ergonomics...

Страница 25: ...porate critical design parameters 4 1 Design Concept The ILM consists of two assemblies that will be procured as a set from the enabled vendors These two components are ILM cover assembly and back pla...

Страница 26: ...e Design Overview The back plate see Figure 4 2 is a flat steel back plate with pierced and extruded features for ILM attach A clearance hole is located at the center of the plate to allow access to t...

Страница 27: ...iameter provides alignment of the load plate The height of the shoulder ensures the proper loading of the IHS to seat the processor on the socket contacts The design assumes the shoulder screw has a m...

Страница 28: ...ture 2 Install the shoulder screw in the single hole near Pin 1 of the socket Torque to a minimum and recommended 8 inch pounds but not to exceed 10 inch pounds 3 Align and place the ILM cover assembl...

Страница 29: ...n testing ILMs from each vendor have been tested with the socket bodies from each of the current vendors The tests include manufacturability bake and thermal cycling See Appendix A for vendor part num...

Страница 30: ...Independent Loading Mechanism ILM 30 Thermal Mechanical Specifications and Design Guidelines...

Страница 31: ...d be derived from a the height of the socket seating plane above the motherboard after reflow given in Appendix C b the height of the package from the package seating plane to the top of the IHS and a...

Страница 32: ...ad 5 Dynamic loading is defined as a load a 4 3 m s 170 in s minimum velocity change average load superimposed on the static load requirement 6 Test condition used a heatsink mass of 500gm 1 102 lb wi...

Страница 33: ...socket Socket Average Contact Resistance EOL 19 mOhm The socket average contact resistance target is calculated from the following equation sum Ni X LLCRi sum Ni LLCRi is the chain resistance defined...

Страница 34: ...ased reliability evaluation methodology which is acceleration factor dependent A simplified process flow of this methodology can be seen in Figure 5 1 A detailed description of this methodology can be...

Страница 35: ...of the appropriate fan speed is based on the relative temperature data reported by the processor s Digital Temperature Sensor DTS The DTS can be read using the Platform Environment Control Interface P...

Страница 36: ...n wherein VCCP exceeds VCCP_MAX at specified ICCP Refer to the loadline specifications in the datasheet 7 Thermal Design Power TDP should be used for processor thermal solution design targets TDP is n...

Страница 37: ...6 2 for discrete points that constitute the thermal profile 2 Refer to Chapter 8 and Chapter 9 for system and environmental implementation details Figure 6 1 Thermal Test Vehicle Thermal Profile for...

Страница 38: ...Power W TCASE_MAX C 0 45 1 50 59 6 2 45 7 52 60 2 4 46 3 54 60 8 6 46 8 56 61 3 8 47 4 58 61 9 10 48 0 60 62 5 12 48 6 62 63 1 14 49 2 64 63 7 16 49 7 66 64 2 18 50 3 68 64 8 20 50 9 70 65 4 22 51 5 7...

Страница 39: ...the fan speed to CA and ambient temperature measurement Notes 1 The ambient temperature is measured at the inlet to the processor thermal solution 2 This column can be expressed as a function of TAMB...

Страница 40: ...t may be subject to change without notice THERM X OF CALIFORNIA 1837 Whipple Road Hayward Ca 94544 Ernesto B Valencia 1 510 441 7566 Ext 242 ernestov therm x com The vendor part number is XTMS1565 6 2...

Страница 41: ...racterized thermal solution it is anticipated that the TCC would only be activated for very short periods of time when running the most power intensive applications The processor performance impact du...

Страница 42: ...en the processor temperature is near the TCC activation temperature Once the temperature has dropped below the trip temperature and the hysteresis timer has expired the operating frequency and voltage...

Страница 43: ...emperature Flag in the IA32_THERM_STATUS MSR will be set This flag is an indicator of a catastrophic thermal solution failure and that the processor cannot reduce its temperature Unless immediate acti...

Страница 44: ...oring devices The processor implements a PECI interface to allow communication of processor thermal and other information to other devices on the platform The processor provides a digital thermal sens...

Страница 45: ...s a relative value to TCC activation target The temperature data reported over PECI is always a negative value and represents a delta below the onset of thermal control circuit TCC activation as indic...

Страница 46: ...hly a temperature change of 1 degree centigrade This linearity is approximate and cannot be ensured over the entire range of PECI temperatures especially as the delta from the maximum PECI temperature...

Страница 47: ...e Digital Thermal Sensor DTS for real time thermal specification compliance Single point of reference for thermal specification compliance over all operating conditions Does not require measuring proc...

Страница 48: ...fic a tio n D T S T e m p T D P T c o n tro l T a 3 0 C c a 0 5 6 4 c a 0 4 4 8 P o w e r C u rre n t S p e c ific a tio n C a s e T e m p T D P T c o n tro l T a 4 5 1 C T a 3 0 C c a 0 2 9 2 P o w e...

Страница 49: ...thermal validation will not require the user to apply a thermocouple to the processor package or measure processor power Note All functional compliance testing will be based on fan speed response to t...

Страница 50: ...e thermal profile As an example the data in Table 7 1 has been plotted in Figure 7 3 to show the required CA at 25 30 35 and 40 C TAMBIENT The lower the ambient the higher the required CA which means...

Страница 51: ...oundary conditions for an ATX tower system are as follows TEXTERNAL 35 C This is typical of a maximum system operating environment TRISE 5 C This is typical of a chassis compliant to CAG 1 1 or TAC 2...

Страница 52: ...me as previously suggested for prior products The thermal solution is mounted on a test fixture with the TTV and tested at the following conditions TTV is powered to the TDP condition Thermal solution...

Страница 53: ...ference thermal solution characterization are provided in Table 7 1 The fan speed control device may modulate the thermal solution fan speed RPM by one of two methods The first and preferred is pulse...

Страница 54: ...al consideration in establishing the fan speed curves is to account for the thermal interface material performance degradation over time 7 4 1 Fan Speed Control Algorithm without TAMBIENT Data In a sy...

Страница 55: ...the data the benefits of the DTS thermal specification become more striking As will be demonstrated below there is still over cooling of the processor even when compared to a nominally ambient aware t...

Страница 56: ...zed for acoustic benefit The DTS thermal specification required CA and therefore the fan speed in this scenario is 1500 RPM This is less than thermistor controlled speed of 2150 RPM even if the assump...

Страница 57: ...ing item Verify if there is TCC activity by instrumenting the PROCHOT signal from the processor TCC activation in functional application testing is unlikely with a compliant thermal solution Some very...

Страница 58: ...1 41 E 07 c 0 00048 d 0 925782 6 Full Speed of 3150 RPM the DHA A thermal solution delivers a CA 0 335 C W based on preliminary testing 7 Minimum speed is limited to 1000 RPM to ensure cooling of oth...

Страница 59: ...ting the processors including critical to function dimensions operating environment and validation criteria 8 1 Heatsink Thermal Solution The reference thermal solutions are active fan solution simila...

Страница 60: ...cooling solution performance This is compliant with the recommendations found in both ATX Specification and microATX Motherboard Interface Specification documents 8 3 Heatsink Mass and Center of Gravi...

Страница 61: ...and carefully evaluate the completed assembly prior to use in high volume Some general recommendations are shown in Table 9 1 The Intel reference heatsinks will be tested in an assembled LGA1156 socke...

Страница 62: ...processor IHS No visible tilt of the heatsink with respect to the retention hardware 3 No signs of physical damage on baseboard surface due to impact of heatsink 4 No visible physical damage to the pr...

Страница 63: ...materials are not fungal growth resistant then MIL STD 810E Method 508 4 must be performed to determine material performance Material used shall not have deformation or degradation in a temperature l...

Страница 64: ...Thermal Solution Quality and Reliability Requirements 64 Thermal Mechanical Specifications and Design Guidelines...

Страница 65: ...se noted all figures in this chapter are dimensioned in millimeters and inches in brackets Figure 10 1 shows a mechanical representation of a boxed processor Note The cooling solution that is supplied...

Страница 66: ...the fan heatsink to ensure unimpeded airflow for proper cooling The physical space requirements and dimensions for the boxed processor with assembled fan heatsink are shown in Figure 10 2 side view a...

Страница 67: ...sor Specifications Note Diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation Figure 10 3 Space Requirements for the Boxed Processor top v...

Страница 68: ...2 pulses per fan revolution A baseboard pull up resistor provides VOH to match the system board mounted fan speed monitor requirements if applicable Use of the SENSE signal is optional If the SENSE s...

Страница 69: ...ides of the fan heatsink Airspace is required around the fan to ensure that the airflow through the fan heatsink is not blocked Blocking the airflow to the fan heatsink reduces the cooling efficiency...

Страница 70: ...tions 70 Thermal Mechanical Specifications and Design Guidelines Figure 10 7 Boxed Processor Fan Heatsink Airspace Keepout Requirements top view Figure 10 8 Boxed Processor Fan Heatsink Airspace Keepo...

Страница 71: ...tsink to fan heatsink The internal chassis temperature should be kept below 40 C Meeting the processor s temperature specification see Chapter 6 is the responsibility of the system integrator The moth...

Страница 72: ...ution provides better control over chassis acoustics This is achieved by more accurate measurement of processor die temperature through the processor s Digital Thermal Sensors DTS and PECI Fan RPM is...

Страница 73: ...mechanical and environmental validation of these solutions This list and or these devices may be subject to change without notice Table A 1 Reference Heatsink Enabled Components Item Intel PN AVC Del...

Страница 74: ...omponents Co Ltd Kai Chang 86 755 3366 8888 x63588 kai_chang avc com tw Delta William Bradshaw 1 510 668 5570 86 136 8623 1080 WBradshaw delta corp com Foxconn Julia Jiang 1 408 919 6178 juliaj foxcon...

Страница 75: ...M Keepout Zone Secondary Side Bottom Figure B 2 Socket Processor ILM Keepout Zone Primary Side Top Figure B 3 Socket Processor ILM Keepout Zone Secondary Side Bottom Figure B 4 Reference Design Heatsi...

Страница 76: ...DO NOT SCALE DRAWING SHEET 1 OF 2 UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14 5M 1994 DIMENSIONS ARE IN MILLIMETERS THIRD ANGLE PROJECTION NOTES 1 DIMEN...

Страница 77: ...18 00 18 00 9 36 9 36 27 33 DEPARTMENT R 2200 MISSION COLLEGE BLVD P O BOX 58119 SANTA CLARA CA 95052 8119 SIZE DRAWING NUMBER REV A1 E21319_REV_L_PAE L SCALE 1 000 DO NOT SCALE DRAWING SHEET 2 OF 2...

Страница 78: ...R CPU PACKAGE ALIGNS WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP INS 2 SOCKET KEEP IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSI...

Страница 79: ...X 4 70 NO ROUTE ON ALL OTHER LAYERS COPPER PAD ON PRIMARY SIDE NON GROUNDED COPPER PAD CAN INSET MAXIMUM OF 127MM FROM THE NO ROUTE EDGE 6 00 0 05 0 03 3X NPTH 3 80 0 05 0 03 11 78 8 00 3 50 17 00 18...

Страница 80: ...Mechanical Drawings 80 Thermal Mechanical Specifications and Design Guidelines Figure B 5 Reference Design Heatsink Assembly...

Страница 81: ...Thermal Mechanical Specifications and Design Guidelines 81 Mechanical Drawings Figure B 6 Reference Fastener Sheet 1 of 4...

Страница 82: ...Mechanical Drawings 82 Thermal Mechanical Specifications and Design Guidelines Figure B 7 Reference Fastener Sheet 2 of 4...

Страница 83: ...Thermal Mechanical Specifications and Design Guidelines 83 Mechanical Drawings Figure B 8 Reference Fastener Sheet 3 of 4...

Страница 84: ...Mechanical Drawings 84 Thermal Mechanical Specifications and Design Guidelines Figure B 9 Reference Fastener Sheet 4 of 4...

Страница 85: ...2 1 333 007 A 1 60 063 NOTES 1 THIS DRAWING TO BE USED IN CONJUNTION WITH SUPPLIED 3D DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE APPLICABLE...

Страница 86: ...0 D REV DRAWING NUMBER SIZE DEPARTMENT E36830 2 01 DWG NO SHT REV R TYP 0 3 0118 7 34 289 R1 4 055 R3 1 122 43 1 3 57 141 5 3 2087 7 35 2894 2X R3 6 1417 1 65 065 135 1 06 042 2X R0 5 0197 R MIN 0 45...

Страница 87: ...6 0 1 685 6 72 0 1 6 25 77 5 6 0 7 5 6 1 3 7 233 5 87 5 7 21 25 17 7 21 2 5229 6 6 6 2 1 0 1 6 5 72 5 2 8556 7 37 7 7 3 17 5 6 5 7 352 7 21 0 7 5 7 5 1 2 127 6 5 1 5 1 180 5 1 6 33529 5 1 6 7 7 7 6 7...

Страница 88: ...Mechanical Drawings 88 Thermal Mechanical Specifications and Design Guidelines...

Страница 89: ...lists the mechanical drawings included in this appendix Table C 1 Mechanical Drawing List Drawing Description Figure Number Socket Mechanical Drawing Sheet 1 of 4 Figure C 1 Socket Mechanical Drawing...

Страница 90: ...UMBER SHALL BE INDICATED IN THIS AREA 8 CHAMFER INDICATES THE CORNER CLOSEST TO PACKAGE PIN A1 9 CONTACT MUST REMAIN OUTSIDE THE CENTRAL CAVITY THROUGHOUT THE ACTUATION STROKE 10 PICK AND PLACE TOOLIN...

Страница 91: ...15 5 4 2 9 2 1 5 2 35 15 96 0 5 16 25 F G THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED...

Страница 92: ...NTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION E27147 3 4 DWG NO SHT REV DEPARTMENT R 2200 MISSION COLLEGE BLVD P O BOX 58119 SANTA...

Страница 93: ...AX 0 6 2X 8 20 18 12 2X 4 5 MAX 2X 2 0 0 1 24 56 0 1 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED D...

Страница 94: ...Socket Mechanical Drawings 94 Thermal Mechanical Specifications and Design Guidelines...

Страница 95: ...al Drawings D Package Mechanical Drawings Table D 1 lists the mechanical drawings included in this appendix Table D 1 Mechanical Drawing List Drawing Description Figure Number Processor Package Drawin...

Страница 96: ...MBER REV A1 E22526 6 SCALE 5 DO NOT SCALE DRAWING SHEET 1 OF 2 FINISH MATERIAL DATE APPROVED BY DATE CHECKED BY DATE DRAWN BY DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLER...

Страница 97: ...RMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION E22526 2 6 DWG NO SHT REV DEPART...

Страница 98: ...Package Mechanical Drawings 98 Thermal Mechanical Specifications and Design Guidelines...

Страница 99: ...t Intel does not make any representations or warranties whatsoever regarding quality reliability functionality or compatibility of these devices Customers are responsible for thermal mechanical and en...

Страница 100: ...DO NOT SCALE DRAWING SHEET 1 OF 1 NOTES 1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE ALIGNS WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP...

Страница 101: ...Thermal Mechanical Specifications and Design Guidelines 101 Heat Sink Back Plate Drawings Figure E 2 Heat Sink Back Plate...

Страница 102: ...Heat Sink Back Plate Drawings 102 Thermal Mechanical Specifications and Design Guidelines...

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