Intel Desktop Board DB85FL Technical Product Specification
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1.8.2
Audio Subsystem Components
The audio subsystem includes the following components:
•
Intel B85 Express Chipset
•
Realtek ALC662s-VD audio codec
•
Front panel audio header that supports Intel HD audio and AC ’97 audio (a 2 x
5-pin header that provides mic in and line out signals for front panel audio
connectors) (yellow)
•
S/PDIF digital audio out header (1 x 4-pin header) (yellow)
•
3-port analog audio input/output stack on the back panel
•
Mono speaker header (1 x 2-pin header) (yellow)
The back panel audio connectors are configurable through the audio device drivers.
The available configurable back panel audio connectors are shown in Figure 4.
Item Description
A
Line-in (Surround)
B
Line-out (Front Speakers)
C
Mic-in (Center/Sub)
Figure 4. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about
Refer to
The locations of the front panel audio header and S/PDIF audio header
Figure 9, page 42
The signal names of the front panel audio header and S/PDIF audio header
Section 2.2.2.1, page 44
The back panel audio connectors
Section 2.2.1, page 41
1.8.2.1
S/PDIF Header
The S/PDIF header allows connections to optical dongles for digital audio output.
