Intel BX80613I7980, Техническое описание

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Thermal Specifications
76 Datasheet, Volume 1
DTS can be read using the Platform Environment Control Interface (PECI) as described
in
Section 6.3 . The temperature reported over PECI is always a negative value and
represents a delta below the onset of thermal control circuit (TCC) activation, as
indicated by PROCHOT# (see
Section 6.2 , Processor Thermal Features). Systems that
implement fan speed control must be designed to use this data. Systems that do not
alter the fan speed only need to ensure the thermal solution provides the

CA
that
meets the TTV thermal profile specifications.
A single integer change in the PECI value corresponds to approximately 1 °C change in
processor temperature. Although each processors DTS is factory calibrated, the
accuracy of the DTS will vary from part to part and may also vary slightly with
temperature and voltage. In general, each integer change in PECI should equal a
temperature change between 0.9 °C and 1.1 °C.
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP), instead of
the maximum processor power consumption. The Adaptive Thermal Monitor feature is
intended to help protect the processor in the event that an application exceeds the TDP
recommendation for a sustained time period. For more details on this feature, refer to
Section 6.2 . Refer to the appropriate processor Thermal and Mechanical Design
Guidelines (see Section 1.2 ). for details on system thermal solution design, thermal
profiles and environmental considerations.
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Refer to the loadline specifications in Chapter 2 .
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at the TCC activation temperature.
3. These specifications are based on initial silicon characterization. These specifications may be further
updated as more characterization data becomes available.
4. Power specifications are defined at all VIDs found in Table 2-1 . The processor may be shipped under
multiple VIDs for each frequency.
5. Target  -ca Using the processor TTV (°C/W) is based on a T
AMBIENT
of 39 °C.
6. Processor idle power is specified under the lowest possible idle state: processor package C6 state.
Achieving processor package C6 state is not supported by all chipsets. See the Intel X58 Express Chipset
Datasheet for more details.
Table 6-1. Processor Thermal Specifications
Processor
Core
Frequency
Thermal
Design Power
(W)
Idle
Power
(W)
Minimum
TTV T
CASE
(°C)
Maximum TTV
T
CASE
(°C)
Target Psi-ca
Using
Processor TTV
(°C/W)
5
Notes
i7-990X 3.46 GHz 130 12 5
See Figure 6-1 ;
Table 6-2
0.222
1, 2, 3, 4,
6
i7-980X 3.33 GHz 130 12 5
See Figure 6-1 ;
Table 6-2
0.222
1, 2, 3, 4,
6
i7-980 3.33 GHz 130 12 5
See Figure 6-2 ;
Table 6-3
0.222
1, 2, 3, 4,
6
i7-970 3.20 GHz 130 12 5
See Figure 6-2 ;
Table 6-3
0.222
1, 2, 3, 4,
6