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Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide

7

Introduction

1

Introduction

As the complexity of computer systems increases, so do the power dissipation
requirements. Care must be taken to ensure that the additional power is properly
dissipated. Typical methods to improve heat dissipation include selective use of
ducting, and/or passive heatsinks.

The goals of this document are to:

• Outline the thermal and mechanical operating limits and specifications for

Intel

®

3210 and 3200 Chipsets.

• Describe a reference thermal solution that meets the specification of

Intel

®

3210 and 3200

Chipsets.

Properly designed thermal solutions provide adequate cooling to maintain Intel

®

3210

and 3200 Chipsets die temperatures at or below thermal specifications. This is
accomplished by providing a low local-ambient temperature, ensuring adequate local
airflow, and minimizing the die to local-ambient thermal resistance. By maintaining
Intel

®

3210 and 3200 Chipsets die temperature at or below the specified limits, a

system designer can ensure the proper functionality, performance, and reliability of the
chipset. Operation outside the functional limits can degrade system performance and
may cause permanent changes in the operating characteristics of the component.

The simplest and most cost-effective method to improve the inherent system cooling
characteristics is through careful chassis design and placement of fans, vents, and
ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for Intel

®

3210 and 3200

Chipsets components only. For thermal design information on other chipset
components, refer to the respective component datasheet. For the Intel

®

ICH9, refer to

the Intel

®

I/O Controller Hub9 (ICH9) Thermal Design Guidelines.

Note:

Unless otherwise specified, the term “MCH” refers to the Intel

®

3210 and 3200

Chipsets.

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Содержание 3200

Страница 1: ...Reference Number 318465 Revision 001 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide November 2007 ...

Страница 2: ...acteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them The Intel 3210 and 3200 Chipset Dual Core Intel Xeon processor 3000 Sequence and Intel Xeon processor 3200 Sequence may contain design defects or errors known as errata ...

Страница 3: ...truded Heatsink Profiles 37 6 4 2 Retention Mechanism Responding in Shock and Vibration 38 6 4 3 Thermal Interface Material 38 6 4 4 Reference Thermal Solution Assembly Process 39 6 5 Reliability Guidelines 40 A Thermal Solution Component Suppliers 43 A 1 Heatsink Thermal Solution 43 B Mechanical Drawings 45 Figures 1 1 Thermal Design Process 8 2 1 MCH Package Dimensions Top View 11 2 2 MCH Packag...

Страница 4: ...Package Drawing 46 B 2 Intel 3210 and 3200 Chipset Motherboard Component Top Side Keep Out Restrictions 47 B 3 Intel 3210 and 3200 Chipset Motherboard Component Back Side Keep Out Restrictions 48 B 4 Intel 3210 and 3200 Chipset Reference Thermal Solution Assembly 49 B 5 Intel 3210 and 3200 Chipset Reference Thermal Solution Heatsink Drawing 50 B 6 Intel 3210 and 3200 Chipset Reference Thermal Solu...

Страница 5: ...Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide 5 Revision History Document Number Revision Number Description Date 318465 001 Initial release of the document November 2007 ...

Страница 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...

Страница 7: ...ng Intel 3210 and 3200 Chipsets die temperature at or below the specified limits a system designer can ensure the proper functionality performance and reliability of the chipset Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component The simplest and most cost effective method to improve the inherent s...

Страница 8: ...lly conductive lid integrated into the package to improve heat transfer to a thermal solution through heat spreading Tcase_max Maximum die or IHS temperature allowed This temperature is measured at the geometric center of the top of the package die or IHS Tcase_min Minimum die or IHS temperature allowed This temperature is measured at the geometric center of the top of the package die or IHS TDP T...

Страница 9: ... in the following documents Note Contact your Intel field sales representative for the latest revision and order number of this document Document Title Document Number Location Intel I O Controller Hub9 ICH9 Thermal Design Guidelines Contact your Intel Field Sales Representative Intel 3210 and 3200 Chipset Datasheet www developer intel com Intel 3210 and 3200 Chipset Specification Update www devel...

Страница 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...

Страница 11: ...Intel ICH9 The Intel 3210 and 3200 Chipset MCH component uses a 40 mm 1 57 in x 40 mm 1 57 in Flip Chip Ball Grid Array FC BGA package with an integrated heat spreader IHS and 1300 solder balls A mechanical drawing of the package is shown in Figure 2 1 For information on the Intel ICH9 package refer to the Intel I O Controller Hub9 ICH9 Thermal Design Guidelines Figure 2 1 MCH Package Dimensions T...

Страница 12: ...nology 12 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide Notes 1 All dimensions are in millimeters 2 All dimensions and tolerances conform to ANSI Y14 5 1994 Figure 2 3 MCH Package Dimensions Bottom View ...

Страница 13: ...TF solder joints of the MCH package 2 2 Package Mechanical Requirements The Intel 3210 and 3200 Chipset package has an Integrated Heat Spreader IHS which is capable of sustaining a maximum static normal load of 15 lbf This mechanical maximum load limit should not be exceeded during heatsink assembly shipping conditions or standard use conditions Also any mechanical system or component testing shou...

Страница 14: ... These specifications are based on limited testing for design characterization Loading limits are for the package only To ensure that the package static load limit is not exceeded the designer should understand the post reflow package height shown in Figure 2 5 The following figure shows the nominal post reflow package height assumed for calculation of a heatsink clip preload of the reference desi...

Страница 15: ...s plan for a heatsink when using the Intel 3210 and 3200 Chipset 3 2 Thermal Specification To ensure proper operation and reliability of the Intel 3210 and 3200 Chipset the case temperatures must be at or between the maximum minimum operating temperature ranges as specified in Table 3 1 and Table 3 2 System and or component level thermal solutions are required to maintain these temperature specifi...

Страница 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...

Страница 17: ...uides to aid system designers in simulating analyzing and optimizing their thermal solutions in an integrated system level environment The models are for use with the commercially available Computational Fluid Dynamics CFD based thermal analysis tool FLOTHERM version 5 1 or higher by Flomerics Inc Contact your Intel field sales representative for the information of the thermal models and user s gu...

Страница 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...

Страница 19: ...d heat spreader heat loss by radiation convection by conduction through thermocouple leads or by contact between the thermocouple cement and the heatsink base To minimize these measurement errors the approach outlined in the next section is recommended 5 1 1 Supporting Test Equipment To apply the reference thermocouple attach procedure it is recommended that you use the equipment or equivalent giv...

Страница 20: ...ce bath or other stable temperature source and at an elevated temperature around 80 C using an appropriate temperature source Wire gauge and length should also be considered as some less expensive measurement systems are heavily impacted by impedance There are numerous resources available throughout the industry to assist with implementation of proper controls for thermal measurements Note 1 It is...

Страница 21: ...ntation of the groove relative to the package pin 1 indicator gold triangle in one corner of the package is shown in Figure 5 3 for the FCBGA7 chipset package IHS Figure 5 2 FCBGA7 Chipset Package Reference Groove Drawing Figure 5 3 IHS Groove on the FCBGA7 Chipset Package on the Live Board ...

Страница 22: ...mocouple Attach Procedure In order to accomplish the thermocouple attach procedure the following steps are required 1 Thermocouple conditioning and preparation 2 Thermocouple attach to the IHS 3 Soldering process 4 Cleaning and completion of the thermocouple installation 5 1 4 1 Thermocouple Conditioning and Preparation 1 Use a calibrated thermocouple as specified in Section 5 1 3 2 Under a micros...

Страница 23: ...ead 5 Using the microscope and tweezers bend the tip of the thermocouple at approximately 10 degree angle by about 0 8 mm 030 inch from the tip Refer to Figure 5 6 5 1 4 2 Thermocouple attach to the IHS 6 Clean groove and IHS with Isopropyl Alcohol IPA and a lint free cloth removing all residues prior to thermocouple attachment 7 Place the Thermocouple wire inside the groove and let the exposed wi...

Страница 24: ...nder the microscope that the Thermocouple bead is still slightly bent if not use a fine point tweezers to put a slight bend on the tip The purpose of this step is to ensure that the Thermocouple tip is in contact with the bottom of groove Refer to Figure 5 9 Figure 5 7 Extending Slightly the Exposed Wire over the End of Groove Figure 5 8 Securing Thermocouple Wire with Kapton Tape Prior to Attach ...

Страница 25: ... wire down inside the groove for about 5 mm from tip and place small piece of Kapton tape to hold the wire inside the groove Refer to Figure 5 10 12 Thermocouple bead is placed into the bottom of the groove Refer to Figure 5 11 and a small piece of tape is installed to secure it under the microscope to perform this task Figure 5 9 Detailed Thermocouple Bead Placement Figure 5 10 Tapes Installation...

Страница 26: ...groove during the melting process Refer to Figure 5 12 14 Measure resistance from the Thermocouple connector hold both wires to a DMM probe to the IHS surface this should display the same value as read during Thermocouple conditioning Section 5 1 4 1 step 3 This step insures the bead is still making good contact to the IHS Refer to Figure 5 13 Figure 5 11 Placing Thermocouple Bead into the Bottom ...

Страница 27: ...down the groove It should be contained to the bead area and only the tip narrow section of the groove This will keep the solder from flowing onto the top of the device or down the groove to the insulation area 16 Cut two small pieces of solder 1 16 inch 0 065 inch 1 5 mm from the roll using tweezers to hold the solder while cutting with a fine blade Refer to Figure 5 15 Figure 5 13 Measuring Resis...

Страница 28: ... ensure that the bead is still properly contacting the IHS 5 1 4 3 Solder Process 19 Turn on the Solder Block station and heat it up to 170 C 5 C Note The heater block temperature must be set at a greater temperature to ensure that the solder on the IHS can reach 150 C 155 C Make sure to monitor the Thermocouple meter when waiting for solder to flow Damage to the package may occur if a temperature...

Страница 29: ...er to Figure 5 17 21 Connect Thermocouple being installed to a second thermocouple meter to monitor the IHS temperature and make sure this doesn t exceed 155 C at any time during the process Refer to Figure 5 17 Note Device in place Two temperature monitoring meters Heater block fixture The heater block is currently reading 157 C and the Thermocouple inside IHS is reading 23 C 22 Place the solder ...

Страница 30: ... to the device to get a better view when the solder starts melting Manually assist this if necessary as the solder sometimes tends to move away from the end of the groove Use fine tip tweezers to push solder into the end of groove until a solder ball is built up Refer to Figure 5 19 Figure 5 18 Observing the Solder Melting Figure 5 19 Pushing Solder Back into the End of Groove ...

Страница 31: ...lder Refer to Figure 5 20 25 Allow the device to cool down Blowing compressed air on the device can accelerate the cooling time Monitor the device IHS temperature with a handheld meter until it drops below 70 C before moving it to the microscope for the final steps 5 1 4 4 Cleaning and Completion of Thermocouple Installation 26 Remove the Kapton tape with tweezers avoid damaging the wire insulatio...

Страница 32: ...ce scratching or other damage during this process 2 Shaving excess solder to insure the IHS surface is flat and will mate properly with the heatsink surface Scratches and protrusions may impact the thermal transfer from IHS 28 Clean the surface of the IHS with Alcohol and wipes use compressed air to remove any remaining contaminants 29 Fill the test of the groove with Loctite 498 Adhesive Verify u...

Страница 33: ...d smooth with no pits or voids If you have void areas in the groove refill them and shave the surface a second time 32 Clean the IHS surface with Alcohol and keep the Thermocouple wire properly managed to avoid insulation damage kinks and tangling 33 Once again measure resistance from the Thermocouple connector hold both wires to a DMM probe to the IHS surface this should display the same value as...

Страница 34: ...Thermal Metrology 34 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide Figure 5 24 Finished Thermocouple Installation ...

Страница 35: ...l specification in the Intel I O Controller Hub9 ICH9 Thermal Design Guidelines 6 1 Operating Environment The reference thermal solution will be designed assuming a maximum local ambient temperature of 55 C The minimum recommended airflow velocity through the cross section of the heatsink fins is 350 linear feet per minute lfm for 1U system and 450 linear feet per minute lfm for 2U system The appr...

Страница 36: ...n Appendix B The location of hole patens and keepout zones for the reference thermal solution are shown in Figure B 2 and Figure B 3 6 4 Thermal Solution Assembly The reference thermal solution for the Intel 3210 and 3200 Chipset is a passive extruded heatsink with thermal interface Figure 6 2 shows the reference thermal solution assembly and associated components Full mechanical drawings of the t...

Страница 37: ...ion uses an extruded heatsink for cooling the chipset MCH Figure 6 3 shows the heatsink profile Other heatsinks with similar dimensions and increased thermal performance may be available A full mechanical drawing of this heatsink is provided in Appendix B Figure 6 2 Design Concept for Reference Thermal Solution Figure 6 3 Heatsink Extrusion Profiles ...

Страница 38: ...on uses Honeywell PCM45 F 0 25mm 0 010 in thick 20mm x 20mm 0 79 in x 0 79 in square Note Unflowed or dry Honeywell PCM45F has a material thickness of 0 010 inch The flowed or wet Honeywell PCM45F has a material thickness of 0 003 inch after it reaches its phase change temperature 6 4 3 1 Effect of Pressure on TIM Performance As mechanical pressure increases on the TIM the thermal resistance of th...

Страница 39: ...Assembly Process 1 Snap the preload clip spring onto the bracket Assemble the bracket with heatsink as shown in Figure 6 4 2 Populate the backplate to the motherboard and align the nuts with the studs on the backplate as shown in Figure 6 5 Figure 6 4 Reference Thermal Solution Assembly Process Heatsink Sub Assembly Step 1 ...

Страница 40: ... be considered as general guidelines Each motherboard heatsink and attach combination may vary the mechanical loading of the component Based on the end user environment the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume The testing will be performed with the sample board mounted on a test fixture The test profi...

Страница 41: ...ty Guidelines Test 1 Requirement Pass Fail Criteria 2 Mechanical Shock 3 drops for and directions in each of 3 perpendicular axes Profile 50 G Trapezoidal waveform 4 3 m s 170 in s minimum velocity change Visual Check and Electrical Functional Test Random Vibration Duration 10 min axis 3 axes Frequency Range 5 Hz to 500 Hz Power Spectral Density PSD Profile 3 13 g RMS Visual Check and Electrical F...

Страница 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...

Страница 43: ...tion Component Suppliers A 1 Heatsink Thermal Solution Part Intel Part Number Quantity Contact Information Heatsink Assembly D96730 001 Monika Chih monika_chih ccic com tw 886 2 29952666 1131 Heatsink D96729 001 1 Retainer D92698 001 1 Nuts Inserts D92621 001 4 Bracket E11663 001 1 Stiffener backplate D94244 001 1 ...

Страница 44: ...Thermal Solution Component Suppliers 44 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...

Страница 45: ...e 49 Intel 3210 and 3200 Chipset Reference Thermal Solution Heatsink Drawing page 50 Intel 3210 and 3200 Chipset Reference Thermal Solution Spring Preload Clip page 51 Intel 3210 and 3200 Chipset Reference Thermal Solution Fastener Nut page 52 Intel 3210 and 3200 Chipset Reference Thermal Solution Bracket 1 of 2 page 53 Intel 3210 and 3200 Chipset Reference Thermal Solution Bracket 2 of 2 page 54 ...

Страница 46: ...Mechanical Drawings 46 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide Figure B 1 Intel 3210 and 3200 Chipset Package Drawing ...

Страница 47: ...ECKED BY 03 15 07 K CEURTER DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14 5M 1994 DIMENSIONS ARE IN MILLIMETERS TOLERANCES LINEAR 0 1MM THIRD ANGLE PROJECTION REVISION HISTORY ZONE REV DESCRIPTION DATE APPROVED 1 PRELIMINARY RELEASE 03 15 07 D94910 1 1 DWG NO SHT REV PARTS LIST DESCRIPTION PART NUMBER ITEM NO QTY PER ASSY 001 002 003 DR...

Страница 48: ...ORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORATION SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 1 2200 MISSION COLLEGE BLVD P O BOX 58119 SANTA CLARA CA 95052 8119 CORP R TMD 1 D94910 X D REV DRAWING NUMBER CAGE CODE SIZE DEPARTMENT D94910 2 1 DWG NO SHT REV 81 3 1890 60 6 2 3858 38 05 1...

Страница 49: ...Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide 49 Mechanical Drawings Figure B 4 Intel 3210 and 3200 Chipset Reference Thermal Solution Assembly ...

Страница 50: ...Mechanical Drawings 50 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide Figure B 5 Intel 3210 and 3200 Chipset Reference Thermal Solution Heatsink Drawing ...

Страница 51: ...O NOT SCALE DRAWING SHEET 1 OF 1 SEE NOTES SEE NOTES FINISH MATERIAL 03 09 07 P BORNEMANN DATE APPROVED BY 03 09 07 R AOKI 03 09 07 A VALPIANI DATE CHECKED BY 03 09 07 K CEURTER DATE DRAWN BY 03 09 07 K CEURTER DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14 5M 1994 DIMENSIONS ARE IN MILLIMETERS ALL UNTOLERANCED LINEAR DIMENSIONS 0 3 ANGL...

Страница 52: ...ITLE BONE TRAIL FASTNER NUT SIZE DRAWING NUMBER REV A1 D92621 1 SCALE 15 DO NOT SCALE DRAWING SHEET 1 OF 1 SEE NOTES SEE NOTES FINISH MATERIAL 03 09 07 P BORNEMANN DATE APPROVED BY 03 09 07 R AOKI 03 09 07 A VALPIANI DATE CHECKED BY 03 09 07 K CEURTER DATE DRAWN BY 03 09 07 K CEURTER DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14 5M 1994...

Страница 53: ... WITH SUPPLIED 3D DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE APPLICABLE AT PART FREE UNCONSTRAINED STATE UNLESS INDICATED OTHERWISE 2 TOLERANCES ON DIMENSIONED AND UNDIMENSIONED FEATURES UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS FOR FEATURE SIZES 10MM LINEAR 07 FOR FEATURE SIZES BETWEEN 10 AND 25 MM LINEAR 08 FOR FEATURE SI...

Страница 54: ...T IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORATION E11663 2 1 DWG NO SHT REV DEPARTMENT R 2200 MISSION COLLEGE BLVD P O BOX 58119 SANTA CLARA CA 95052 8119 PST SIZE DRAWING NUMBER REV A1 E11663 1 SCALE 3 DO NOT SCALE DRAWING SHEET 2 OF 2 2X 4 5 0 07 8 2 TYP 2 8 REV B TYP 2 7 5 2 55 4 1 5 A A ...

Страница 55: ...244 1 SCALE 2 DO NOT SCALE DRAWING SHEET 1 OF 1 SEE NOTES SEE NOTES FINISH MATERIAL 03 12 07 K KOEPSELL DATE APPROVED BY 03 12 07 R AOKI 03 12 07 A VALPIANI DATE CHECKED BY 03 09 07 K CEURTER DATE DRAWN BY 03 09 07 K CEURTER DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14 5M 1994 DIMENSIONS ARE IN MILLIMETERS ALL UNTOLERANCED LINEAR DIMEN...

Страница 56: ...CALE 3 DO NOT SCALE DRAWING SHEET 1 OF 1 SEE NOTES SEE NOTES FINISH MATERIAL 03 09 07 P BORNEMANN DATE APPROVED BY 03 09 07 R AOKI 03 09 07 A VALPIANI DATE CHECKED BY 03 09 07 K CEURTER DATE DRAWN BY 03 09 07 K CEURTER DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14 5M 1994 DIMENSIONS ARE IN MILLIMETERS ALL UNTOLERANCED LINEAR DIMENSIONS ...

Страница 57: ...5052 8119 PST TITLE BONE TRAIL INSULATOR BACK PLATE SIZE DRAWING NUMBER REV A1 D92624 1 SCALE 3 DO NOT SCALE DRAWING SHEET 1 OF 1 SEE NOTES SEE NOTES FINISH MATERIAL 03 09 07 P BORNEMANN DATE APPROVED BY 03 09 07 R AOKI 03 09 07 A VALPIANI DATE CHECKED BY 03 09 07 K CEURTER DATE DRAWN BY 03 09 07 K CEURTER DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANC...

Страница 58: ...EMANN DATE APPROVED BY 03 09 07 R AOKI 03 09 07 A VALPIANI DATE CHECKED BY 03 09 07 K CEURTER DATE DRAWN BY 03 09 07 K CEURTER DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14 5M 1994 DIMENSIONS ARE IN MILLIMETERS ALL UNTOLERANCED LINEAR DIMENSIONS 0 3 ANGLES 1 THIRD ANGLE PROJECTION 0 05 A B 3 51 0 08 4 5 8 NOMINAL BACK PLATE INSULATOR TH...

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