Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
15
Thermal Specifications
3
Thermal Specifications
3.1
Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the MCH component to
consume maximum power dissipation for sustained time periods. Therefore, in order to
arrive at a more realistic power level for thermal design purposes, Intel characterizes
power consumption based on known platform benchmark applications. The resulting
power consumption is referred to as the Thermal Design Power (TDP). TDP is the target
power level that the thermal solutions should be designed to. TDP is not the maximum
power that the chipset can dissipate.
For TDP specifications, see
for Intel
®
3210 Chipset and
for Intel
®
3200. FC-BGA packages have poor heat transfer capability into the board and have
minimal thermal capability without a thermal solution. Intel recommends that system
designers plan for a heatsink when using the Intel
®
3210 and 3200 Chipset.
3.2
Thermal Specification
To ensure proper operation and reliability of the Intel
®
3210 and 3200 Chipset, the
case temperatures must be at or between the maximum/minimum operating
temperature ranges as specified in
. System and/or component
level thermal solutions are required to maintain these temperature specifications. Refer
to
for guidelines on accurately measuring package die temperatures.
Notes:
1.
The above specifications are based on post-si analysis.
2.
The maximum idle power is the worst-case idle power with L1 ASPM state.
Notes:
1.
The above specifications are based on post-silicon analysis.
2.
The maximum idle power is the worst case idle power with L1 ASPM state.
§
Table 3-1.
Intel
®
3210 Chipset Thermal Specifications
Parameter
Value
Notes
T
case_max
96 °C
T
case_min
5 °C
TDP
dual channel
20.2 W
DDR2-667
TDP
dual channel
21.3 W
DDR2-800
P
Idle_max
11.3 W
Table 3-2.
Intel
®
3200 Chipset Thermal Specifications
Parameter
Value
Notes
T
case_max
97 °C
T
case_min
5 °C
TDP
dual channel
18.9 W
DDR2-667
TDP
dual channel
20.0 W
DDR2-800
P
Idle_max
11.3 W
Содержание 3200
Страница 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Страница 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Страница 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Страница 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Страница 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Страница 44: ...Thermal Solution Component Suppliers 44 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
