6 of 59
2022-23-05
User Guide for XENSIV™ K
IT CSK BGT60TR13C
Table of contents
The key component on the wing board is
Infineon’s XENSIV™
BGT60TR13C radar sensor. It enables ultra-wide
bandwidth frequency-modulated continuous-wave (FMCW) operation in a small package that also includes the
antennas. Sensor configuration and data acquisition are enabled with a digital interface, and the integrated state
machine enables independent data acquisition with power mode optimization for lowest power consumption.
The board also comprises the
XENSIV™
DPS368 digital barometric pressure sensor. This high-precision pressure
sensor can detect very small changes in barometric pressure, which makes it an ideal device for use cases where
accurate pressure event detection is required (e.g., opening of doors or windows, or fall detection).
Having both the radar sensor and pressure sensor on the board gives the possibility to develop and test more
complex scenarios where data from both sensors is combined for more reliable event detection.
2.2
CYSBSYSKIT-DEV-01
The Rapid IoT connect developer kit carries a CYSBSYS-RP01 Rapid IoT connect system-on-module (SoM). The
Rapid IoT connect SoM includes a PSoC™ 6 MCU device, a CYW43012 single
-chip radio, on-board crystals,
oscillators, chip antenna, and passive components. The PSoC™ 6 MCU device on the Rapid IoT connect
SoM has
two cores: Cortex M0+ (CM0+) and Cortex M4 (M4). The firmware running on the PSoC™ 6 MCU can be split into
two parts: the application and device management. The device management part runs on the Cortex-M0+ core.
The applications part run on the Cortex-M4 core. The Cotex-M0+ core is called the network processor (NP). The
Cortex-M4 core is called the customer processor (CP). Resources such as flash, RAM and the peripherals are
divided between the NP and CP.
The Rapid IoT connect SoM is the easiest way to provide a secure, scalable, and reliable connection from your
device to your cloud. The Rapid IoT connect SoM is a pre-certified 802.11ac-friendly dual-band (2.4 and 5.0
GHz) Wi-Fi and Bluetooth® 5.0-
compliant combo radio with an integrated PSoC™ 6
Secure IoT MCU provided in
an easy-to-use package. Included within the SoM are the crystals, oscillators, RF switches, passive components,
and antenna to help accelerate development of your secure IoT products. It provides up to 51 I/Os in a 26.6 x
14.0 x 2.5-mm castellated surface mount PCB for easy manufacturing.
Along with the Rapid IoT connect developer kit, Infineon® offers the Infineon® Rapid IoT connect cloud
platform. This Rapid IoT connect cloud platform allows users to quickly and easily connect their kits to the
cloud and see real time sensor data. Rapid IoT connect cloud platform provides several example projects that
can be easily programmed onto the user’s kit.
The user signs up with the Infineon® Rapid IoT connect cloud platform and registers the Rapid IoT connect
developer kit with the unique serial number printed on it. The user chooses an application for evaluation on the
Rapid IoT connect developer kit. The Rapid IoT connect cloud platform configures specific application images
which are available for download and programming on the Rapid IoT connect developer kit.
Rapid IoT connect cloud platform offers an array of services such as: Firmware over the air (FOTA) updates,
device management services such as Location services - parameter monitoring, and much more. Users who
desire to use these services for a large number of devices can connect with their respective Infineon® sales
support.
2.2.1
CYSBSYSKIT-DEV-01 main components
The Rapid IoT connect developer kit has the following features:
•
CYSBSYS-RP01 module
•
512-Mbit external Quad SPI NOR Flash that provides a fast, external expansion memory for data and code
•
KitProg3 on-board SWD programmer/debugger, USB-UART, and USB-I2C bridge functionality. KitProg3 is
compatible with Mbed OS development flow and is CMSIS-DAP capable.
