Singlestone
PBA 313 07
Preliminary Product Overview
4/2004
7
2.1 General Features
General
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Low power consumption, programmable Power down mode
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Chip in advanced low power CMOS technology
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External supply-voltage 3.0V..4.75 V, recommended 3.3 V +/- 5 %
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Extended temperature range – 40°C .. +85°C
Interfaces
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UART for UART-HCI with HW-handshake (Baudrate up to 3 Mbaud)
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PCM interface (slave- and master-mode; programmable PCM slot allocation)
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JTAG
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GPIO for control of external devices
Digital-Section
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Digital demodulation gives best performance in sensitivity, co- and adjacent channel performance
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Digital offset compensation and symbol synchronization / frame synchronization
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GFSK-modulator (over-sampling at typ. 9-bit-resolution) with amplitude adjustment and high-
performance A/D-converter for RX-data
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Digital part (Noise-shaper, Gaussian impulse filter) of
Σ∆
-Fractional-N-PLL
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CVSD transcoder for voice conformant to BLUETOOTH wireless technology
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A-law, u-Law and linear PCM also possible
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Baseband and Linkmanager Firmware up to HCI in internal ROM
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4 kbit E
2
PROM for storing Bluetooth device data
RF and Analog Section
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Analog part of
Σ∆
-Fractional-N-PLL for receive and transmit path (multi-modulus-divider, phase
detector and charge pump) on chip
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Fully integrated and balanced VCO with integrated varactors and inductors.
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On chip 2.5 GHz RF driver amplifier up to + 5 dBm output power (Fine tuning in the range of -16 - +
5 dBm in 1.5 dB steps)
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Integrated LNA
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Fully integrated Balun, switch and antenna filter giving one single-ended RF interface, no additional
external RF components
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Chip-integrated supply voltage regulator for VCO
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On module 26 MHz reference clock
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On module voltage regulator for single supply voltage.
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Typical sensitivity -83 dBm
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Typical output power +2.5 dBm
Software
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Baseband, Link Manager and HCI functionality is incorporated by ProBlue Firmware in chip-
integrated ROM.
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Infineon specific HCI+ commands to support enhanced features
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Configuration data (e.g. Bluetooth device address) are loaded from internal E
2
PROM after reset.
Optionally, configuration data may be provided by the host via HCI+ command.
Package
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LGA 9 x 8 pads
