Singlestone
PBA 313 07
Preliminary Product Overview
4/2004
6
2 General Device Overview
Infineon’s Singlestone - PBA 313 07 is a ready-to-use Class2 Bluetooth module solution targeted for
data and audio applications in the 10 meters personal area range.
BLUETOOTH wireless technology is an open industry standard for short range wireless
communication with both data and voice transmission capability (up to 723 kbit/s data asymmetrically
or up to 3 voice channels simultaneously). Singlestone is a Bluetooth 1.1 pre-qualified component, so
any further development and qualification efforts for the user are minimized. It is already hardware
prepared for the upcoming Bluetooth 1.2 Standard, which will improve the quality of voice connections,
support the co-existence with WLAN solutions using the same frequency band and accelerate the
connection setup.
Integrating the baseband, link manager and RF-transceiver, Singlestone closes the gap between the
Bluetooth air interface (external antenna, 2.4 GHz ISM band) and the standardized host-controller-
interface (HCI), which is physically realized as a full-duplex UART port (HW-handshake optional). In
parallel, the PCM interface is suitable for audio connections.
Around Infineon’s BlueMoon Single Cellular – PMB 8761 Bluetooth chip, all essential components for
a complete Bluetooth solution are integrated in the Singlestone module. A 26 MHz temperature
compensated crystal oscillator (TCXO) provides the highly accurate Bluetooth clock, an E²PROM
holds the application specific configuration data which is loaded after power-up reset, and an
integrated balun-filter component ensures optimized RF matching between the chip and the external
antenna. Only a 32.768 kHz real-time clock, which is available in most target applications, must be
provided to the Singlestone module.
Bluetooth stack software supporting the extended feature set of Infineon’s BlueMoon family and a
comprehensive portfolio of Bluetooth profiles are available from our SW partners ported to a variety of
host architectures.
The device is designed for a broad range of wireless applications in the consumer, automotive and
industrial segments, as well as for interconnection of cellular phones, desktop PCs, laptops, and
PDAs.
The device is available in a shielded LGA package (11.85 x 10.6 mm²) with 8x9 pads.
