
User Manual
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Revision 1.0
2019-09-17
EVAL-M3-IM564 User Manual
iMOTION
™
Modular Application Design Kit
Hardware description of EVAL-M3-IM564
Thermal resistance between junction to ambient R
thJA
is divided into 2 parts as following formular, thermal
resistance between junction to case R
thJC
and thermal resistace between case to ambient R
thCA
.
=
+
And them we could get the formular as follows.
=
∆
.
=
−
×
Acoording to the test set up, test result is shown in the Figure 30 below. The IPM case temperature is detected
about 1 hours until the temperature is stable.
Figure 30 Heatsink thermal testing result
So, we could roughly get the final case to ambient resistance value as:
= 2.4℃/
5.4.2
System power output capability
In order to test the total ouput power capability of the MADK system as Figure 2, DCB case temperature is
tested with different MADK output power.
Test conditions are: Ambientent temperature Ta=25
℃
, AC input voltage is VAC=220V/50Hz, Bus voltage is
VDC=380V, PFC PWM frequency is 50 KHz and inverter frequency is 6 KHz.
Figure 31 MADK Ouput Power Capability Test Result