IEI Technology NOVA-9102, Руководство пользователя

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NOVA-9152 and NOVA-9102 5.25” Motherboard
Page 31
2.6.3 Winbond W83627EHG Super I/O chipset
The Winbond W83627EHG Super I/O chipset is connected to the MCP55Pro system
chipset through the LPC bus.
The Winbond W83627EHG is an LPC interface-based Super I/O device that comes with
Environment Controller integration, floppy disk controller, UART controller and IR
controller. Some of the features of the Winbond W83697HG chipset are listed below:
LPC Spec. 1.01 compliant
LDRQ# (LPC DMA) and SERIRQ (serial IRQ) supported
Hardware monitor functions integrated
Microsoft PC2000/PC2001 Hardware Design Guide compliant
ACPI DPM (Device Power Management) supported
Some of the Super I/O features are described in more detail below:
2.6.3.1 Super I/O LPC Interface
The LPC interface on the Super I/O complies with the Intel
®
Low Pin Count Specification
Rev. 1.01. The LPC interface supports both LDRQ# and SERIRQ protocols as well as PCI
PME# interfaces.
2.6.3.2 Super I/O UART Controller
There are two high-speed 16550 compatible UART controllers integrated onto the Super
I/O chipset. Both controllers have 16-byte send/receive FIFO. Some of the features of the
UART controllers are listed below:
MIDI compatible
Fully programmable serial-interface characteristics:
o
5, 6, 7, or 8-bit characters
o
Even, odd or no parity bit generation/detection
o
1, 1.5 or 2 stop bits generation
Internal diagnostic capabilities:
o
Loop-back control for communications link fault isolation