Clearances
A minimum of 2mm clearance should
be given to the bottom surface except
for a 10mm maximum diameter area
around the bottom mounting holes.
There should be 7mm of clearance
between Utrastar 9LP & 18XP drives
that are mounted with their top sides
facing each other. Drives from other
manufacturers may require additional
spacing due to stray magnetic fields.
For proper cooling it is suggested that a
minimum clearance of 7 mm be
provided under the drive and on top of
the drive.
Mounting
Refer to Ultrastar 9LP & 18XP
Hardware/ Functional Specification
“Drive Mounting Guidelines” for more
details on how to mount the drive.
The drive can be mounted with any
surface facing down. The drive has both
side and bottom mounting holes. Refer
to diagrams below for the location of
these mounting holes for each
configuration.
The
maximum allowable penetration of
the mounting screws is 3.8 mm. Screws
longer than 3.8 mm may cause
permanent damage to the drive.
The recommended torque to be applied
to the mounting screws is 0.8 Newton
metres 0.2 Newton metres.
Grounding requirements of the disk
enclosure
The disk enclosure is at Power Supply
ground potential. It is allowable for the
user mounting scheme to common the
Disk Enclosure to Frame Ground
potential or to leave it isolated from
Frame Ground.
The drives mounting frame must be
within 150 millivolts of the drives power
supply ground. At no time should more
than 35 milliamps of current (0 to 100
Mhz) be injected into the disk
enclosure.
The
following is a list of measurement
points and their temperature (maximum
and reliability). Maximum temperature
must not be exceeded at the worst case
drive and system operating conditions
with the drive randomly seeking,
reading and writing. Reliability
temperatures
must not be exceeded at
the nominal drive and system operating
conditions with the drive randomly
seeking, reading and writing.
Maximum and Reliable
Operating Temperature Limits
Maximum Optimum
Disk Enclosure Top 149
o
F(65
o
C) 122
o
F(50
o
C)
Disk Enclosure
Bottom
149
o
F(65
o
C) 122
o
F(50
o
C)
Channel Module
1
203
o
F(90
o
C) 167
o
F(80
o
C)
SCSI Module
194
o
F(80
o
C) 158
o
F(60
o
C)
Microprocessor
Module 176
o
F(95
o
C) 140
o
F(75
o
C)
Controller Module 194
o
F(100
o
C) 158
o
F(75
o
C)
Spindle Motor
Driver Module
194
o
F(90
o
C) 158
o
F(80
o
C)
Location of side mounting holes.
* 42.0mm for 18.22GB models.
Note: Operating the file above the
maximum temperatures may cause
permanent damage.
Maximum recommended
temperatures are for nominal ambient
temperature.
Note: The diagrams below define where
measurements should be made.
Showing where the modules are located
on the bottom side of the card and the
measurement locations on the bottom
of the or top of the casting. There must
be sufficient air flow through the drive
so that the casting and module
temperature limits defined above are
not exceeded.
Module Temperature
Measurement Notes:
1. Centre on the top surface of the
module.
2. If copper tape is used to attach
temperature sensors, it should be no
larger than 6 mm square.
3. A thermal sensor is fitted to the
electronics card. Several temperature
thresholds are continuously monitored
and the results updated into the drive
log. This is used to provide a thermal
history and does not interrupt drive
operation.
60 +/- 0.2
101.5 +/- 0.2
147 MAX
(6X) 6-32UNC-2B X 3.8 MAX
6
.35
+
/-
0
.2
5
*2
6
.1
MA
X
101.
6
+
/-
0
.2
5
41.25 +/- 0.5
44.45 +/- 0.25
9
5
.2
5
+
/- 0
.2
5
3
.1
8
+
/- 0
.2
5
Temperature Measurements
