IBM BladeCenter HS23E
4
Energy efficiency
The HS23E offers the following energy-efficiency features to save energy, reduce operational costs,
increase energy availability, and contribute to the green environment:
The component-sharing design of the BladeCenter chassis provides ultimate power and cooling
savings.
Energy-efficient planar components help lower operational costs.
The Intel Xeon processor E5-2400 product family offers better performance over the previous
generation, while fitting into the same TDP limits.
Intel Intelligent Power Capability powers individual processor elements on and off as needed, to
reduce power draw.
Low-voltage Intel Xeon processors draw less energy to satisfy demands of power and thermally
constrained data centers and telecommunication environments.
Low-voltage 1.35 V DDR3 memory RDIMMs consume 19% less energy than 1.5 V DDR3 RDIMMs.
Solid-state drives (SSDs) consume as much as 80% less power than traditional 2.5-inch HDDs.
The HS23E uses hexagonal ventilation holes, a part of IBM Calibrated Vectored Cooling™
technology. Hexagonal holes can be grouped more densely than round holes, providing more efficient
airflow through the system.
IBM Systems Director Active Energy Manager™ provides advanced power management features with
actual real-time energy monitoring, reporting, and capping features.
Locations of key components and connectors
The following figure shows the front view of the server, indicating key components.
Figure 2. Front view of the IBM BladeCenter HS23E
