.
Doc. No.
DOC- 00036367
REV.
Issued Date
1/12/2007
A06
Revised Date
11/19/2008
Doc. Title
Neon Service Manual
Page
78 of 88
HTC CONFIDENTIAL
SM-TP002-0706
HTC Corporation
9.2 Board Level 2.5 Repairs
Basic Repair Instructions for Component Replacement:
Step 1
Place the solder-proof tape to cover the surrounding area of the components which being replaced.
Warning
：
DO NOT overheat the tape and components to avoid the tape melted and the components damaged
Step 2
Use Heater Gun (HAKO850B, set the temperature between 350°C, Air Speed 3~5) to remove the
components.
Step 3
Wait till the temperature cool down before removing the solder-proof tape to avoid other components
being removed
Step 4
After the damaged or defective components have been replaced; clear the surroundings for solder
and flux residues.
Notice:
A.
All the parts of the PCB should be checked if it is missing or not.
B.
The OP must to wear antistatic wrist band. Don't put boards together and avoid hitting them.
C.
When you solder and repair that the soldering iron ,temperature must be setup 415 .
℃
(The
temperature range is 415 ±5 ),and the solder wire's diameter is 0.4/0.5/0.6mm
℃
℃
(SAC 305 (1.1%)
