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EL-MF877-00                                                                                                Page  2 
Template Revision C  

Last revalidation date 09-May-2018 

                 

 

 

 

 

  

HPI instructions for this template are available at 

EL-MF877-01

  

Item Description 

Notes 

Quantity of 
items 
included in 
product

 

Electrolytic Capacitors / Condensers measuring greater 
than 2.5 cm in diameter or height 

  In adapter 

External electrical cables and cords 

 

DP cable*1, USB3.0 cable*1,  Power cord*1, 

Adapter*1

 

Gas Discharge Lamps 

            

Plastics containing Brominated Flame Retardants 
weighing > 25 grams (not including PCBs or PCAs 
already listed as a separate item above)  

 

           

Components and parts containing toner and ink, 
including liquids, semi-liquids (gel/paste) and toner 

Include the cartridges, print heads, tubes, vent 
chambers, and service stations.             

Components and waste containing asbestos 

            

Components, parts and materials containing refractory 
ceramic fibers 

            

Components, parts and materials containing 
radioactive substances 

            

2.0 Tools Required

 

List the type and size of the tools that would typically be used to disassemble the product to a point where components and 
materials requiring selective treatment can be removed. 

Tool Description 

Tool Size (if 
applicable) 

Screw driver

 

Hexagon Screw Driver

 

Flathead screwdriver

 

           

           

           

           

3.0 Product Disassembly Process

 

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment 
including the required steps to remove the external enclosure:  

1.

 

 Remove stand by quick release button to separate the stand and monitor head. 

2.

 

 Use tool to separate rear cover from monitor head through tear down slot.  

3.

 

 Use tool to release screw from bucket, then separate bucket and trim from monitor head by hand.Separate top corner first 
then pull up the bucket to separate bucket and SHD. 

4.

 

 Use tool to release screws on SHD, then separate the SHD from monitor head, separate the mylar and thermal pad which on 
the SHD. Release two screws on the SHD to separate the release button and springs. 

5.

 

 Tear the tape from lamp wire ,motor wire ,color sensor wire, then disassemble the lamp wire, motor wire ,color sensor wire, 
LVDS FFC*4 and ctrl-BD FFC from connector.  

Содержание OMEN X 25f

Страница 1: ...ntity of items contained within the product which require selective treatment in the right column as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm I F Board 1 Ctrl Board 1 Ctrl Lens Board 1 LED Board 1 LED Driver Board 1 G sync2 Board 1 6 Batteries excluding Li Ion batteries ...

Страница 2: ...s that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed Tool Description Tool Size if applicable Screw driver 1 Hexagon Screw Driver 0 Flathead screwdriver 1 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatme...

Страница 3: ...m the bracket 11 Remove the battery which is on the interface board 12 Remove the gasket thermal pad and tape on the chassis 13 Use tool to release screws and separate base 14 Use tool to release screws and separate base cover 15 Use tool to release screws and separate VESA from stand 16 Use tool to release screws and separate the back cover from stand 17 Use tool to release screws and separate hi...

Страница 4: ...ion date 09 May 2018 HPI instructions for this template are available at EL MF877 01 3 Use tool to separate rear cover from monitor head through tear down slot 4 Use tool to release screw bezel trin then separate bezel trin plastic lens and bezle trin SHD ...

Страница 5: ...EL MF877 00 Page 5 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 5 Separate rear cover by hand ...

Страница 6: ...on C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 6 Separate ctrl FFC stand LED FFC 7 Use tool to release screw then separate ctrl PCB stand LED PCB and power LED PCB from rear cover ...

Страница 7: ...EL MF877 00 Page 7 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 8 Separate internal and release tape 3 power wire and LVDC FFC ...

Страница 8: ... HPI instructions for this template are available at EL MF877 01 9 Use tool to release screw then separate middle frame 10 Use tool to release screw then separate interface PCB and LED driver PCB 11 Remove the screws form column and separate plastic part 12 Remove cable clip ...

Страница 9: ...EL MF877 00 Page 9 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 ...

Страница 10: ...vision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 13 Remove the screw from hook and remove hook 14 Remove the screw from BKT and remove life module and disassemble lift module ...

Страница 11: ...EL MF877 00 Page 11 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 15 Remove the rubber from base ...

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