NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Thermal paste is used on the processor (1 and 2), the
graphics processor (3), the heat sink sections (2 and 4), and the system board (5 and 6).
Component replacement procedures
43
Содержание 17-ap000
Страница 1: ...OMEN X by HP 17 Laptop PC Maintenance and Service Guide ...
Страница 4: ...iv Important Notice about Customer Self Repair Parts ...
Страница 6: ...vi Processor information ...
Страница 8: ...viii Safety warning notice ...
Страница 12: ...xii ...
Страница 25: ...Component Description Right click the Power icon and then select Power Options Top 13 ...
Страница 31: ...Computer major components 19 ...
Страница 36: ...Component Spare part number Hinge cap 940612 001 LED cable 940592 001 24 Chapter 3 Illustrated parts catalog ...
Страница 65: ...Reverse this procedure to install the power board Component replacement procedures 53 ...