Mechanics
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3.3
Tempering, storage and soldering
Tempering
netRAPID have to be tempered to reduce unwanted moisture before they
are soldered onto the host system. If the moisture is not reduced, then the
heating during the soldering process to more than 200°C can lead to
possible destruction of electronic parts of the netRAPID. To avoid this, the
netRAPID chip carriers have to be tempered 24 h at 80°C.
Hilscher tempers netRAPID devices before they are shipped. After
tempered, netRAPID devices are shipped welded within a tray.
Moisture sensitivity level
The Moisture Sensitivity Level (MSL) is .
Storage
The netRAPID in a welded (sealed) tray can be stored up to 1 year. After 1
year the netRAPID devices have to be tempered again, before soldered
onto a host system.
Soldering
netRAPID devices can be placed on the PCB of the host system for SMD
production. netRAPID can be picked and placed (from the tray to the PCB
of the host system) using asymmetric suck in. Place netRAPID on the top
side of the PCB of the host system.
Note:
The thermal profile for reflow soldering depends on the used
soldering paste and the used reflow system. Read the data sheet of
the manufacturer of the used soldering paste for requirements to
the thermal profile.
When using the Heraeus soldering paste
Sn/Ag/Cu-95.5/4/0.5
(F620CU0.5-88M3 lead free), then the following thermal profile is
recommended:
netRAPID 90 | Design guide
DOC190601DG01EN | Revision 1 (Draft 10) | English | 2019-09 | Preliminary | Public
© Hilscher 2019