2
Table 1 Temperature and humidity requirements
Temperature Humidity
Operating temperature: 0°C to 45°C (32°F to 113°F)
Storage temperature: –40°C to +70°C (–40°F to +158°F)
5% RH to 95% RH, noncondensing
Cleanliness
Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points, especially when indoor relative humidity is low. In the worst
case, electrostatic adsorption can cause communication failure.
Table 2 Dust concentration limit in the equipment room
Substance
Concentration limit (particles/m
3
)
Dust particles
≤
3 x 10
4
(No visible dust on the tabletop in three days)
NOTE:
Dust diameter
≥
5 µm
The equipment room must also meet limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in
Table 3 Harmful gas limits in an equipment room
Gas
Maximum concentration (mg/m
3
)
SO
2
0.2
H
2
S 0.006
NH
3
0.05
NO
2
0.04
Cl
2
0.01
Cooling system
The gateway uses left-to-right airflow for heat dissipation, as shown in
Содержание MSR2600-6-X1
Страница 32: ...25 Figure 24 Removing a transceiver module...