D2619 (RX/TX300 S5)
Technical Manual
13
3
Features
3.1
Overview
Processors
–
1 or 2 Intel
®
Xeon™ processors of the 5500 serie
–
2 processor sockets LGA1366 for Intel
®
Xeon™ processors
–
integrated memory controller
–
32 KB L1 cache (on-die, data per core)
–
32 KB L1 cache (on-die, instruction per core)
–
256 KB second level cache per core
–
up to 8 MB onchip shared third level cache
–
2 Intel® QuickPath Interconnect with up to 6,4 GT/s in each direction
–
2x VRM 11.1 onboard (EVRD)
Main memory
–
2x 9 slots for main memory DDR3 800 / 1066 / 1333 single-, dual- or quad-
ranked RDIMM memory modules with 2 GB, 4 GB and 8 GB
–
maximum 144 GB of memory
–
minimum 2 GB (1 memory module)
–
maximum 32 Gbit/s band width (DDR3)
–
up to 3 dual or 2 quad memory rows per channel
–
ECC multiple-bit error detection and single-bit error correction
–
memory scrubbing functionality
–
Single Device Data Correction (SDDC) function (Chipkill™)
–
Mirroring
–
Sparing
Chips on the system board
–
Intel
®
5520 chipset
–
Intel
®
ICH10 Base (Intel
®
82801JIB)
–
Intel
®
dual-port Gigabit Ethernet controller Intel 82575EB
–
TPM 1.2 Infineon SLB9635 TT1.2 card
–
2 MByte SPI flash (BIOS / iSCSI, PXE Bootcode)
–
Server Management controller iRMC S2 with integrated graphic controller
–
16 MByte SPI flash (code) for iRMC S2
–
1 MByte SPI flash (data) for iRMC S2
–
32Mx16-667 DDR2 SRAM for iRMC S2
Содержание D2619
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