MT5F37311
© Fuji Electric Co., Ltd. All rights reserved.
4.1 Electrostatic discharge protection
If excessive static electricity is applied to the control terminal, the module may be damaged. Please
take countermeasures against static electricity when handling the module.
Assembly environment relating to ESD shall be within specified value shown in the specification
sheet.
When unpacking the product, it is important that there be no control pin contact when handling the
product after removing the conductive foam, as this could cause electrostatic discharge damage. When
installing the product in a piece of equipment, it is requested that you only remove the conductive foam
just before PCB mounting in order to prevent electrostatic discharge damage. (Refer to the work flow in
Figure 2)
4. Attaching the PCB to the IGBT Module
3
4. PCB mounting
and control terminal
soldering
3. Conductive foam
removal
Fig. 2 Conductive foam removal procedures
1. Unpacking
2. Moving process
Do not remove
the conductive
foam
Do not remove
the conductive
foam
Remove the
conductive
foam
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