Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of DSP56F803EVM - KIT EVALUATION FOR DSP56F803
Contact us: [email protected] Website: www.integrated-circuit.com
DSP56F803EVM User Manual, Rev. 5
2-18
Freescale Semiconductor
2.18 CAN Interface
The 56F803EVM board contains a CAN physical-layer interface chip that is attached to the
MSCAN_RX and MSCAN_TX pins on the 56F803. The EVM board uses a Philips,
PCA82C250, high speed, 1Mbps, physical layer interface chip. Due to the +5.0V operating
voltage of the CAN chip, a pull-up to +5.0V is required to level shift the Transmit Data output
line from the 56F803. A primary, J3, and a daisy-chain, J13, CAN connector are provided to
allow easy daisy-chaining of CAN devices. Refer to
Figure 2-14
for a connection diagram and to
Table 2-8
for the CAN signals.
Figure 2-14. CAN Interface
56F803
MSCAN_TX
MSCAN_RX
CAN CONNECTOR
TXD
RXD
SLOPE
VREF
VCC
GND
CANL
PCA82C250T
1
3
5
7
9
2
4
6
8
10
X
JG10
1
2
120
CAN TERMINATION
CANH
J3
U15
1
4
8
+5.0V
3
5
2
DAISY-CHAIN
CAN CONNECTOR
7
6
X
X
X
X
X
X
1
3
5
7
9
2
4
6
8
10
X
J13
X
X
X
X
X
X
35 / 69
35 / 69
