3
• Clean the area around the mounting hole and
roughen it with abrasive paper (type 220).
• Clean the contact surfaces of the accelerometer
/ adapter and of the machine with solvent.
• Allow the contact surfaces to dry and then ap-
ply a thin film of screw paste (LOCTITE 243) to
improve signal transmission.
• Screw in the adapter and tighten with a wrench
Adapter: 10 to 20 Nm
• Screw in the accelerometer by hand (3 to 7 Nm).
Notes
Excessive torque can damage the threads on the
accelerometer or machine part. Too little torque
can allow the accelerometer to work loose and
cause measurement errors!
If the accelerometer is affixed to non-grounded
machine components (e.g. belt-driven fan), the
accelerometer must be grounded to prevent static
charges.
Mounting the bonded adapter
Tools required:
– Hand-held drill
– Drill bits with depth gauge (3.5 mm)
– File
– Compressed air for cleaning out the hole
– Two-component adhesive (WEICON HB 300,..)
Note
The machine must be switched off during instal-
lation. Afterwards, it must not be switched on for
at least 24 hours to prevent mechanical vibrations
during the hardening process.
• Select bonding position:
Leave enough space around the adapter in order
to apply the bonding compound.
• Flattening and roughening:
Sand down any paint on the mounting surface to
bare metal (Ø > 30 mm).
Level out the mounting surface if necessary.
Roughen the mounting surface with a file (filing a
few grooves in a diamond pattern provides great-
er adhesion.)
Optional, and only if drilling at the mounting lo-
cation is possible:
• Bore hole for centering pin.
– Drill depth approx. 5 mm, Diameter 3.6 mm.
If drilling is not possible, the centering pin on the
accelerometer base can be removed.
30
3.6
5
• Clean location and mix bonding compound:
Clean mounting surface and bonding socket with
a residue-free degreasant and a clean cloth. Then
allow both metal surfaces to dry completely.
• Mix bonding compound for use.
• Apply bonding compound:
A
pply a thin layer of bonding compound evenly
with a wooden spatula (approx. 1 mm thick) to
the base of the adapter and the mounting surface.
• Mount adapter:
Press the adapter gently against the mounting
surface and turn it a little to evenly distribute the
bonding compound. Do not remove excess bond-
ing compound. Additional bonding compound
can be applied at the bonding location for higher
stability.
Note
An adhesive tape may be used to hold the adapter
in place during the first hour of hardening.
