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L850-GL Hardware User Manual Page 34 of 54
Figure 3-14 Reference Circuit for USB 2.0 Interface
Since the module supports USB 2.0 High-Speed, it is required to use TVS diodes with equivalent
capacitance of 1pF or smaller ones on the USB_D-/D+ differential signal lines, it is recommended to use
0.5pF TVS diodes.
USB_D- and USB_D+ are high speed differential signal lines with the maximum transfer rate of480 Mbit/s,
so the following rules shall be followed carefully in the case of PCB layout:
USB_D- and USB_D+ signal lines should have the differential impedance of 90 ohms.
USB_D- and USB_D+ signal lines should be parallel and have the equal length, the right angle
routing should be avoided.
USB_D- and USB_D+ signal lines should be routed on the layer that is adjacent to the ground
layer, and wrapped with GND vertically and horizontally.
3.4.2.3 USB3.0 Interface Application
The reference circuit is shown in Figure 3-15:
Figure 3-15 Reference Circuit for USB 3.0 Interface
USB 3.0 signals are super speed differential signal lines with the maximum transfer rate of5Gbps.So the
following rules shall be followed carefully in the case of PCB layout:
USB3.0_TX-/USB3.0_TX+ and USB3.0_RX-/ USB3.0_RX+ are two pairs differential signal lines,
the differential impedance should be controlled as100 ohms.
The two pairs differential signal lines should be parallel and have the equal length, the right