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Table 31. Four-layer board stacking thickness
Layer
Material
Thickness (um)
- -
Solder Mask
- -
Lay 1
0.33OZ+Plating
25
- -
PP 1080
65
Lay 2
0.5OZ+Plating
25
- -
0.510 mm (H/H OZ)
508
Lay 3
0.510 mm+Plating
25
- -
PP 1080
65
Lay 4
0.33OZ+Plating
25
- -
Solder Mask
- -
The thickness from Lay 1 to Lay 2 is 65 um, RF trace is 4 mil, and the distance from RF to
GND is greater than 3 times of RF line width.
The blue area is Lay 1 and the red area is Lay 2, the highlighted part is RF line.
Figure 23. RF traces
6. Radio Frequency
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