Fastrax IT321, Техническое описание

Страница: 24 / 35

2007-11-19
Page 24 of 35
IT321_Tech_doc_12
5. MANUFACTURING
5.1 Assembly
The IT321 module supports only assembly and soldering in a reflow
process on the top side of the PCB. Suggested solder paste stencil
height is 150um minimum to ensure sufficient solder volume.
5.2 Suggested Reflow soldering profile
Suggested peak reflow temperature is 250C for ten seconds (Pb-free
paste). Absolute max reflow temperature is 260C for ten seconds.
5.3 Moisture sensitivity
Note that the IT321 is moisture sensitive at MSL 3 (see the standard
IPC/JEDEC J-STD-020C). The module must be stored in the original
moisture barrier bag or if the bag is opened, the module must be re-
packed or stored in a dry cabin (according to the standard
IPC/JEDEC J-STD-033B). Factory floor life in humid conditions is 1
week for MSL 3.
5.4 Tape and reel
One reel contains 500, 1000, or 1500 modules.