HCPL-3700 A
C/DC to Logic Interface Optocoupler
©2005 Fairchild Semiconductor Corporation
www.fairchildsemi.com
HCPL-3700 Rev. 1.0.1
10
Carrier Tape Specifications
Reflow Profile
0.30
±
0.05
4.0
±
0.1
4.0
±
0.1
Ø1.55
±
0.05
Ø1.6
±
0.1
1.75
±
0.10
12.0
±
0.1
10.30
±
0.20
13.2
±
0.2
0.1 MAX
User Direction of Feed
4.90
±
0.20
16.0
±
0
7.5
±
0.1
10.30
±
0.20
• Peak reflow temperature: 225
C (package surface temperature)
• Time of temperature higher than 183
C for 60–150 seconds
• One time soldering reflow is recommended
215
C, 10–30 s
225
C peak
Time (Minute)
0
300
250
200
150
100
50
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Temperature (°C)
Time above 183
C, 60–150 sec
Ramp up = 3
C/sec