Chapter 1 Product Introduction
MEC-5003B
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Chapter 1 Product Introduction
Overview
MEC-5003B is a high performance and low power embedded fanless PC. It adopts
EMB-1811 modular main board, which is developed based on Intel® HM55 PCH
chipset with Intel® Core™ I5 520M 2.4G/Celeron™ P4500 1.86G processor and one
DDR3 SO-DIMM memory slot up to 4GB. The fanless PC dissipates heat via al-alloy
chassis body. The product provides excellent airtightness, dust-proof, heat dissipation
and anti-vibration performance. The external IO connectors can be brought out via
carrier board directly. It supports both DC 18-26V power supply and AC 220V input
via power adapter.
The chassis is molded via al-alloy with small form factor, compact and solid structure;
the chassis body also serves as a heat sink to dissipate heat. The product can be used
in a wide range of harsh environments, such as heavy contamination, heavy dust and
serious EMC, etc. Featuring small form factor, complete functions and strong
environment adaptability, the product can be widely applied in various embedded
fields, such as machinery device, intelligent transportation and industrial automation
control, etc.
Main Function
Microprocessor
Supports Intel® Core™ i7, i5, i3/Pentium®/Celeron™ Mobile series CPU of
rPGA988 package, such as Core™ i5-520M, Celeron™ P4500.
Note: due to the power supplying capacity of the ATX power socket as well as the
fanless design, the power consumption of the adopted CPU shall be no more than
35W.
