EVC BDM100, Руководство пользователя

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EVC electronic GmbH -29- BDM100 Module
Interconnections for Siemens SIM2K ECUs
Pict. A: The main connector of the SIM2K ECU.
On the SIM2K ECU the power distribution is
provided by the stronger contact pins of the
lage contact chamber of the main
connector.
Use separate wires to connect GND, IGN
and +12Vcc to the pins of the main
connector shown in picture.A
Attention:
On the SIM2K board a 12-pad array is
located as shown in picture B
Two opposite pads of that pad-array are not
connected to a conductor trace and that is
why they left uncontacted both.
The ten spring contacts of the BDM144
probe will only contact the lower ten
pads of the pad array.
The both pads in front of the array will not
be contacted as shown in picture C.
Now place the BDM144 probe into the
positioning frame and carefully put the tips
of the spring contact probes on the pads on
the board. If the length of the spring contact
pins is not long enough, pull the spring
contact pins up to the first rast position from
their receptacles.
Pict. B
: the text on the left explains why in this case
Pin1 is on the second position.
Pict. C: The BDM144 probe contacts the board of
the SIM2K ECU.