Ericsson ROK 101 007, Руководство пользователя, Страница: 15 / 21

ROK 101 007
15
Preliminary
Placement
The placement machine should be
able to recognize odd BGA combina-
tions (all ball recognition preferred)
and be able to pick the component
asymmetrical. The module contains a
flat pick-area of 10mm diameter
minimum. The weight of the module
is typically 2.8gr.
Storage
Keep the component in its dry pack
when not yet using the reel. After
removal from the dry pack ensure
that the modules are soldered onto
the PCB within 48 hours.
Marking
Every module is marked with the
following information on the:
a) Component designation: “ROK
101 007”.
b) Ericsson’s name and logotype.
c) Manufacturing code (place, year,
week) and batch number.
d) CE logotype
e) Type approval RTA no. See
manual
Ordering Information
Package Part No.
30 GP ROK 101 007/1
30 SSP ROK 101 007/2
Packaging
All devices will be delivered in a
package protecting them from
electrostatic discharges and me-
chanical shock. The package will be
marked with the following informa-
tion:
a) Delivery address.
b) Purchase order-number
c) Type of goods and component
designation.
d) Ericsson’s name and logotype.
e) Date of manufacture and batch
number.
f) Number of components in the
package.
Microelectronics
Ericsson Microelectronics AB
SE-164 81 Kista-Stockholm, Sweden
Telephone: +46 8 757 50 00
www.ericsson.com/microe
1522-ROK 101 007 Rev. PA5
© Ericsson Microelectronics AB, April 2000
Information given in this data sheet is believed
to be accurate and reliable. However no
responsibility is assumed for the consequences
of its use nor for any infringement of patents or
other rights of third parties which may result
from its use. No license is granted by
implication or otherwise under any patent or
patent rights of Ericsson Microelectronics.
These products are sold only according to
Ericsson Microelectronics' general conditions of
sale, unless otherwise confirmed in writing.
Specifications subject to change
without notice.
Abbreviations
ASIC - Application Specific
Integrated Circuit
BER - Bit Error Rate
CMOS - Complementary Metal Oxide
Semiconductor
C/I - Carrier to Interference Ratio
DCE - Data Circuit terminating
Equipment
GP - Gold Print
HCI - Host Controller Interface
ISM - Industrial Scientific and
Medical
PCB - Printed Circuit Board
PCM - Pulse Code Modulation
PDA
- Personal Digital Assistant
PtP - Point to Point
Rx - Receive
SIG - Special Interest Group
SSP - Screen Solder Print
Tx - Transmit
UART - Universal Asynchronous
Receiver Transmitter
USB - Universal Serial Bus
VCO - Voltage Controlled Oscillator