ROK 101 007
14
Preliminary
Antenna
The ANT pin should be connected to
a 50
Ω
-antenna interface, thereby
supporting the best signal strength
performance. Ericsson Microelec-
tronics can recommend application
specific antennas – see Appendix C.
Power-up Sequence
There is no need for a power up
sequence if VCC, ON and VCC_IO
are tied together.
A power up sequence, if used, shall
be applied accordingly: Connection
of the supply rails, GND and then
V
CC
; then the ON signal should be
applied in order to initiate the internal
regulators; and finally, the V
CC
_
IO
supply rail can be activated.
The power-down sequence is similar
to the power-up procedure but in the
reverse format. Therefore, the
disconnection of the signals shall be
as follows: V
CC
_
IO
, ON,V
CC
and finally
GND.
RESET#
The assignment of the RESET# input
is to generate a reset signal to the
complete Bluetooth module. During
power-up the reset signal is set ‘low’
automatically so that power supply
glitches are avoided. Therefore no
reset input should be required after
power-up.
When implementing an external
RESET#, the signal should be fed
from an open drain output.
Power
There are three inputs to the Voltage
Management section (V
CC
, V
CC_IO
,
ON). V
CC
is the supply voltage that is
typically 3.3V.
A separate power supply rail (V
CC_IO
)
is provided for the I/O ports, UART,
PCM and USB. To be compliant with
the USB 1.1 specification, V
CC_IO
>
3.11V. V
CC_IO
can either be connected
to V
CC
or to a dedicated supply rail,
which is the same as the logical
interface of the host.
VCC
ON
VCC_IO
t
d_VCC_IO_o
t
d_VCC_IO_o
ff
t
d_off
t
d_on
t
d
t
r
t
r_on
t
t
f_on
Parameter
Min
Nom
Max
Unit
t
r
1
ms
t
r_on
60
µ
s
t
f_on
60
µ
s
t
d_on
t
r
µ
s
t
d_off
µ
s
t
dvcc_io_on
t
d_on
µ
s
t
dvcc_io_off
t
d_off
µ
s
Figure 15. Power up sequence
Table 3. Power up parameters
Shielding / EMC Requirements
The module has its own RF shielding
and is approved according to the
standards by FCC and ETSI.
If the approval number is not visible
on the outside when the module is
utilized in the final product, an
exterior label must state that there is
a transmitter module inside the
product.
Ground
Ground should be distributed with
very low impedance as a ground
plane. Connect all GND pins to the
ground plane.
Assembly Guidelines
Solder Paste
The ROK 101 007 module is made
for surface mounting and the SSP
connection pads have been formed
after printing eutectic Tin/Lead solder
paste. The solder paste to use is not
critical as long as this is a normal
eutectic solder paste. A preferred
solder paste height is 150
µ
m.
Soldering Profile
It must be noted that the module
should not be allowed to be hanging
upside down in the re-flow operation.
This means that the module has to
be assembled on the side of the PCB
that is soldered last.
The re-flow process should be a
regular surface mount soldering
profile (full convection strongly
preferred); the ramp-up should not
be higher than 2
o
C/s and with a peak
temperature of 210-235
o
C during 20-
60 seconds.
Pad Size
It is recommended that the pads on
the PCB should have a diameter of
0.7-0.9 mm. The surface finish on the
PCB pads should be Nickel/Gold or a
flat Tin/Lead surface or OSP (Organic
Surface Protection).