USER MANUAL V0.8
© 2009 EnOcean | www.enocean.com
PTM 33x / 33xC User Manual V0.8 | Page 15/20
PTM 33X / 33XC
3.5
Soldering information PTM 332/332C
PTM 332 has to be soldered according to IPC/JEDEC J-STD-020C standard.
PTM 332 shall be handled according to Moisture Sensitivity Level MSL4 which means a floor
time of 72 h. PTM 332 may be soldered only once, since one time is already consumed at
production of the module itself.
Once the dry pack bag is opened, the desired quantity of units should be removed and the
bag resealed within two hours. If the bag is left open longer than 30 minutes the desiccant
should be replaced with dry desiccant. If devices have exceeded the specified floor life time
of 72 h, they may be baked according IPC/JEDEC J-STD-033B.
Devices packaged in moisture-proof packaging should be stored in ambient conditions not
exceeding temperatures of 40 °C or humidity levels of 90% r.h..
PTM 332 modules have to be soldered within 6 months after delivery!
