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Thermal Validation
MVME6100 Single Board Computer Installation and Use (6806800D58E
)
108
The preferred measurement location for a component may be junction, case, or air as specified
in the table. Junction temperature refers to the temperature measured by an on-chip thermal
device. Case temperature refers to the temperature at the top, center surface of the
component. Air temperature refers to the ambient temperature near the component.
Table B-1 Thermally Significant Components
Reference
Designator
Generic Description
Max. Allowable
Component
Temperature (deg. C)
Measurement
Location
U3-U11, U64-
U72
DDR SDRAM
70
Air
U84, U95
Gigabit Ethernet Transceiver
129
Case
U82, U83
Cache
115
Case
U45, U46
Programmable Logic Device
70
Air
U32
PCI Bridge
70
Air
U20
Discovery II
110
Case
U15
Clock Generator
85
Air
U14, U22
Clock Buffer
85
Air
U12
MC7457RX, 1.267 GHz Processor
103
Case
U21
Tsi148 VME Bridge ASIC
100
Содержание MVME6100 Series
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