EKF SC9-TOCCATA, Руководство пользователя

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SC9-TOCCATA • CompactPCI® Serial CPU Board • 11th Generation Intel® Processors
Thermal Considerations
In order to avoid malfunctioning of the SC9-TOCCATA, take care of appropriate cooling of the
processor and system, e.g. by a cooling fan suitable to the maximum power consumption of the
CPU chip actually in use. The processor contains digital thermal sensors (DTS) that are readable via
special CPU registers or via PECI bus. DTS allows to get the temperatures of each CPU core
separately.
Two further temperature sensors, one of it located in the system hardware monitor NCT7491,
allows for acquisition of the boards surface temperature and the thermal state of the onboard
system memory channel. Beside this the NCT7491 also keeps a PECI 3.0 master for CPU DTS
monitoring and supervises most of the supply voltages. A suitable tool on Microsoft Windows®
systems to display both, the temperatures as well as the supply voltages, would be HWiNFO64,
which can be downloaded from the web.
The SC9-TOCCATA is equipped with a passive heatsink. Its height takes into account the 4HP
limitation in mounting space of a CompactPCI® Serial board. In addition, a forced vertical airflow
through the system enclosure (e.g. bottom mount fan unit) is strongly recommended (>20m
3
/h
or 2m/s (400LFM) around the CPU slot). Be sure to thoroughly discuss your actual cooling needs
with EKF. Generally, the faster the CPU speed the higher its power consumption. For higher
ambient temperatures, consider increasing the forced airflow to 3m/s (600LFM) or more.
For high performance applications also 8HP heatsink solutions are available.
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