Eiki LC-XBM31, Руководство по обслуживанию

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A16
Diagrams & Drawings KT8-XBM3100
do not use solder containing lead.
This product has been manufactured using lead-free
solder in order to help preserve the environment.
Because of this, be sure to use lead-free solder
when carrying out repair work, and never use solder
containing lead.
Lead-free solder has a melting point that is 30–40 °C
(86–104 °F) higher than solder containing lead, and
moreover it does not contain lead which attaches easily
to other metals. As a result, it does not melt as easily
as solder containing lead, and soldering will be more
difficult even if the temperature of the soldering iron is
increased.
The extra difficulty in soldering means that soldering
time will increase and damage to the components or
the circuit board may easily occur.
Because of this, you should use a soldering iron and
solder that satisfy the following conditions when
carrying out repair work. Also, soldering work must be
done in a short time.
Soldering iron
Use a soldering iron which is 70 W or equivalent, and
which lets you adjust the tip temperature up to 450
°C (842 °F) It should also have as good temperature
recovery characteristics as possible.
Solder
Use solder with the metal content and composition
ratio by weight given in the table below. Do not use
solders which do not meet these conditions.
Metal content Tin (Sn) Silver (Ag) Copper (Cu)
Composition
ratio by weight
96.5 % 3.0 % 0.5 %
Note:
If replacing existing solder containing lead with lead-
free solder in the soldered parts of products that have
been manufactured up until now, remove all of the
existing solder at those parts before applying the lead-
free solder.
Note on Soldering