in.
in.
mm
in.
in
mm
ZD28
.03
1/32
.08
ZD29
.04
3/64
1.0
ZD30
.06
1/16
1.5
in.
in.
mm
.30
5/16 7.6
ZD70
.08
3/32
2.0
ZD71
B
PART
NO.
HOLE DIAMETER
DESCRIPTION
HOLE
DIA.
Economy**
Surface
Sweep**
W
Hot Tip Desoldering Tip
Replacement
Desoldering Tip
SMD Desoldering Tip
Medium & Long Life
Desoldering Tip
Hole Dia. = .06 in.
Side Sweep**
Hole Dia. = .06 in.
*Tin New Iron Tips at Low Temperaturebefore using.
**Non-Plated Alloy
Hot Tip set-up
Heater Set-up
Side Sweep Tips
al-
lows removal of sol-
der from the compo-
nent side of the
board.
Surface Sweep Tips
re-
moves excess solder on
pads for flatter surface,
prior to SMD remount-
ing.
RS383
Retaining
Sleeve
AC736
Tip Adapter
HT01
AC737
Accumulator
Bushing
Side Sweep
Desoldering Tip
HC273
Threaded
Retaining
Collar
