ECS B75H2-AM2, Руководство пользователя, Страница: 6 / 52

2
Introducing the Motherboard
Feature
• Accommodates the 2 nd /3 rd Generation Intel
®
Ivy/Sandy Bridge proces-
sors
• Supports “Hyper-Threading” technology CPU
• One PCI Express x16 Gen3 port
The motherboard uses an LGA1155 type of socket that carries the following
features:
Processor
Chipset
• Supports DDR3 1600/1333/1066 DDR3 SDRAM with Dual-channel ar-
chitecture
• Accommodates four unbuffered DIMMs
• Up to 4GB per DIMM with maximum memory size up to 16 GB
Memory
Audio
• 5.1+2 Channel High Definition Audio Codec
• Meets Microsoft Windows Logo Program and Lync audio requirements
• All DACs supports 44.1k/48k/96k/192kHz sample rate
• Software selectable 2.5V/3.2V/4.0V VREFOUT
• Direct Sound 3D TM compatible
• Power Support: Digital: 3.3V; Analog: 5.0V
The Intel B75 Chipset is a single-chip with proven reliability and performance.
• Support one PCI Express x1 slot
• Integrated one SATA 6.0 Gb/s Host Controller
• Integrated three SATA 3.0 Gb/s Host Controllers
• Eight USB 2.0 ports are supported
• Serial Peripheral Interface (SPI) support
• Integrated Graphics Support with PAVP 3.0
• Intel ® High Definition Audio Controller
LAN
The onboard LAN provides the following features:
• Supports PCI Express
TM
1.1
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE802.3, IEEE802.3u, IEEE802.3ab
• Wake-on-LAN and remote wake-up support
“Hyper-Threading” technology enables the operating system into thinking
it’s hooked up to two processors, allowing two threads to be run in parallel, both
on separate “logical” processors within the same physical processor.