Chengdu Ebyte Electronic Technology Co., Ltd.
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Chengdu Ebyte Electronic Technology Co.,Ltd
8
39
LCD-SEG0
Input/Output
MCU GPIO
40
GND
-
Ground wire, connected to the power reference ground
41
LCD-SEG3
Input/Output
MCU GPIO
42
LCD-COM3
Input/Output
MCU GPIO
43
LCD-SEG4
Input/Output
MCU GPIO
44
LCD-SEG5
Input/Output
MCU GPIO
45
UART0-RX
Input
UART0-RX pin
46
UART0-TX
Output
UART0-TX pin
47
LCD-SEG6
Input/Output
MCU GPIO
48
LCD-SEG7
Input/Output
MCU GPIO
49
LCD-SEG8
Input/Output
MCU GPIO
50
LCD-SEG9
Input/Output
MCU GPIO
51
VCC
-
Power supply, range 1.8V~3.7V (recommend to add ceramic filter capacitor)
52
GND
-
Ground wire, connected to the power reference ground
For more information about module pin definition, software driver and communication protocol, please see
4 Hardware and Software Guide
4.1 Hardware Design
It is recommended to use a DC stabilized power supply to supply power to the module, and the power ripple
coefficient should be as small as possible, and the module should be reliably grounded;
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module;
Please check the power supply to ensure that it is within the recommended power supply voltage. If it exceeds the
maximum value, it will cause permanent damage to the module;
Please check the stability of the power supply, and the voltage should not fluctuate greatly and frequently;
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, and the whole machine is conducive to long-term stable operation;
The module should be as far away as possible from the power supply, transformer, high-frequency wiring and other
parts with large electromagnetic interference;
High-frequency digital wiring, high-frequency analog wiring, and power wiring must avoid the bottom of the
module. If it is necessary to pass under the module, assume that the module is soldered to the Top Layer, and the top
layer of the contact part of the module is covered with copper (all copper And well grounded), it must be close to
the digital part of the module and routed in the Bottom Layer;
Assuming that the module is soldered or placed on the Top Layer, it is also wrong to randomly route the wires on
the Bottom Layer or other layers, which will affect the stray and receiving sensitivity of the module to varying
degrees;
Assuming that there are devices with large electromagnetic interference around the module, it will greatly affect the
performance of the module. According to the intensity of the interference, it is recommended to stay away from the
module. If the situation permits, proper isolation and shielding can be done;
Assuming that there are traces with large electromagnetic interference around the module (high-frequency digital,
