Ebyte E22-400T30S, Руководство пользователя

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Chengdu Ebyte Electronic Technology Co., Ltd. E22-400T30S_User Manual _EN
Copyright ©2012–2020, Chengdu Ebyte Electronic Technology Co., Ltd.
22
Chapter 12 Welding Operation Instructions
12.1 Reflow Temperature
Profile Feature Curve Feature Sn-Pb Assembly Pb-Free Assembly
Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Min. preheat temperature 100℃ 150℃
Preheat temperature max (Tsmax) Max. preheating temperature 150℃ 200℃
Preheat Time (Tsmin to Tsmax)(ts) Preheat time 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) Average rate of ascent 3℃/second max 3℃/second max
Liquidous Temperature (TL) Liquidus temperature 183℃ 217℃
Time
（
tL
）
Maintained Above
（
TL
）
Time above liquidus 60-90 sec 30-90 sec
Peak temperature
（
Tp
）
Peak temperature 220-235℃ 230-250℃
Aveage ramp-down rate
（
Tp to Tsmax
）
Average rate of decline 6℃/second max 6℃/second max
Time 25℃ to peak temperature Time from 25°C to peak temperature 6 minutes max 8 minutes max
12.2 Reflow Soldering Profile