AMBE-2000™ Vocoder Chip Users Manual
Version 4.92, June, 08
DVSI Confidential Proprietary, Subject to Change
Page 13
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3 Hardware Information
3.1
Special Handling Instructions
The AMBE-2020™ uses the TM320LC541B-66 core. For greater details on handling, electrical, packaging, or timing specs
please refer to the TMS320-C54x data sheet at
http://www.ti.com/sc/pcsheets/sprs039c/sprs039c.pdf
.
Although the AMBE-2020™ Vocoder Chip incorporates input protection circuitry, to avoid damage from the accumulation of
a static charge, industry standard electrostatic discharge precautions and procedures must be employed during handling and
mounting.
The 100 pin TQFP package design of the AMBE-2020™ Vocoder Chip allows it to be mounted by infrared reflow, vapor-
phase reflow or equivalent processes. The peak package body temperature must not exceed 220
°
C.
The AMBE-2020™ Vocoder Chip requires baking before mounting, if any of the following conditions exist:
•
Humidity indicator card (included in packaging) shows exposure to > 20 % when read
at 23
°
C + 5
°
C
•
Devices were not shipped in a package designated as “moisture controlled.”
•
Not mounted within 168 hours of receipt, at factory conditions of <30
°
C and <60%
RH
•
If the device has not been stored at < 20% RH
DVSI’s recommended bake out procedures:
•
For low-temperature device containers: 192 hours at 40
°
C + 5
°
C / -0
°
C and < 5%
Relative Humidity
•
For high-temperature device containers : 24 hours at 125
°
C + 5
°
C.
3.1.1
Storage
To insure maximum shelf life in long term storage, AMBE-2020™ Vocoder Chips should be kept in a moisture controlled
package at <40
°
C and <90% Relative Humidity
