DIGITAL-LOGIC AG
MSEP800 Manual V1.0G
115
13
T
HERMAL
S
PECIFICATIONS
13.1
Thermal Analysis for Case Integration
Since the integrated heatsink is unidirectional, the airflow must be exactly in the direction of the heatrails. If
possible, mount the board vertically, so that the heatrails show up/down. The self produced airflow is around
3m/sec in this case.
Special attention must be given to the mounting of the PC-product in a fully closed case/box. The thermal
energy will be stored in the inner room of this environment.
If the case may have a fan:
1.
The hot air must be exchanged with a filtered fan by cool air from outside.
2.
The hot air must be cooled with a heat exchanger.
If the case may not have any fan or opening to exchange the hot air:
1.
The heatsink of the CPU must be mounted directly to a heatsink integrated in the case.
The thermal energy does not go through the air. It will be conducted directly through the
alloy of the heatsink outside.
Содержание MICROSPACE MSEP800
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