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Chapter 1 Introduction
6
ENVIRONMENT
Temperature
Operating: 0 to 60°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
MECHANICAL
Dimensions
microATX Form Factor
244mm (9.6") x 244mm (9.6")
Compliance
PICMG COM Express
®
R3.0, Type 7
Basic, Compact Modules
Chapter 1 - Introduction
Specifications
Chapter 1
EXPANSION
Interface
B1: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
B2: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
B3: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
B4: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
REAR I/O
Ethernet
4 x 10GbE LAN (2 x RJ-45, 2 x SFP+) by 10GBASE-KR interface
2 x 1GbE LAN (RJ-45) (one from module; another from BMC for remote management)
USB
4 x USB 3.0/2.0
Serial
1 x RS-232 (DB-9) (supports by BMC which default is debug port and may switch to
normal RS-232)
INTERNAL
I/O
Serial
2 x Serial Interface Connectors (TX/RX) (2.0mm pitch)
SATA
2 x SATA 3.0 (up to 6Gb/s)
DIO
1 x 8-bit DIO (4 input, 4 output)
1 x SDIO (available upon request)
LPC
1 x LPC
SMBus
1 x SMBus
BMC
Features
1. IPMI 2.0
2. Web Browser Support
3. Web Interface
4. iKVM (keyboard, video and mouse)
5. Virtual Media
6. 3rd Party Authentication
7. Firmware Update
8. SMASH/CLP
9. WS-MAN
10. Network Service
Processor
AST2500
SDRAM
DDR4-2400 1200MHz 8Gb memory down
Display
Through BMC to convert VGA signal
VGA: resolution up to 1920 x 1200 x 32bpp (share with SOC 16MB memory)
POWER
Type
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Connector
4-pin ATX 12V power
24-pin ATX power
RTC Battery CR2032 Coin Cell