CY8C23433, CY8C23533
Document Number: 001-44369 Rev. *B
Page 34 of 37
Packaging Information
This section illustrates the packaging specifications for the CY8C23x33 PSoC device, along with the thermal impedances for each
package, solder reflow peak temperature, and the typical package capacitance on crystal pins.
Figure 19. 32-Pin (5x5 mm) QFN
4. DIMENSIONS ARE IN MILLIMETERS
2. BASED ON REF JEDEC # MO-248
NOTES:
1. HATCH AREA IS SOLDERABLE EXPOSED PAD
BOTTOM VIEW
TOP VIEW
SIDE VIEW
3. PACKAGE WEIGHT: 0.0388g
001-42168
LQ32
*C
COMPANY CONFIDENTIAL
CYPRESS
TITLE
SIZE
PART NO.
DWG NO
REV
SEE NOTE 1
32L QFN 5 X 5 X 0.55 MM PACKAGE OUTLINE 3.5 X 3.5 EPAD
(SAWN TYPE)
A
001-42168 *C
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