CY7C1324H
Document #: 001-00208 Rev. *B
Page 3 of 15
Pin Definitions
Name
I/O
Description
A0, A1, A
Input-
Synchronous
Address Inputs used to select one of the 128K address location
s. Sampled at the rising
edge of the CLK if ADSP or ADSC is active LOW, and CE
1
,
CE
2
, and
CE
3
are sampled active.
A
[1:0]
feed the 2-bit counter.
BW
A,
BW
B
Input-
Synchronous
Byte Write Select Inputs, active LOW
. Qualified with BWE to conduct Byte Writes to the
SRAM. Sampled on the rising edge of CLK.
GW
Input-
Synchronous
Global Write Enable Input, active LOW
. When asserted LOW on the rising edge of CLK, a
global Write is conducted (ALL bytes are written, regardless of the values on BW
[A:B]
and BWE).
BWE
Input-
Synchronous
Byte Write Enable Input, active LOW
. Sampled on the rising edge of CLK. This signal must
be asserted LOW to conduct a Byte Write.
CLK
Input-Clock
Clock Input
. Used to capture all synchronous inputs to the device. Also used to increment the
burst counter when ADV is asserted LOW, during a burst operation.
CE
1
Input-
Synchronous
Chip Enable 1 Input, active LOW
. Sampled on the rising edge of CLK. Used in conjunction
with CE
2
and CE
3
to select/deselect the device. ADSP is ignored if CE
1
is HIGH. CE
1
is sampled
only when a new external address is loaded.
CE
2
Input-
Synchronous
Chip Enable 2 Input, active HIGH
. Sampled on the rising edge of CLK. Used in conjunction
with CE
1
and CE
3
to select/deselect the device. CE
2
is sampled only when a new external
address is loaded.
CE
3
Input-
Synchronous
Chip Enable 3 Input, active LOW
. Sampled on the rising edge of CLK. Used in conjunction
with CE
1
and
CE
2
to select/deselect the device. CE
3
is sampled only when a new external
address is loaded.
OE
Input-
Asynchronous
Output Enable, asynchronous input, active LOW
. Controls the direction of the I/O pins.
When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tri-stated,
and act as input data pins. OE is masked during the first clock of a Read cycle when emerging
from a deselected state.
ADV
Input-
Synchronous
Advance Input signal, sampled on the rising edge of CLK
. When asserted, it automatically
increments the address in a burst cycle.
ADSP
Input-
Synchronous
Address Strobe from Processor, sampled on the rising edge of CLK, active LOW
. When
asserted LOW, addresses presented to the device are captured in the address registers.
A
[1:0]
are also loaded into the burst counter. When ADSP and ADSC are both asserted,
only ADSP is recognized. ASDP is ignored when CE
1
is deasserted HIGH
ADSC
Input-
Synchronous
Address Strobe from Controller, sampled on the rising edge of CLK, active LOW
. When
asserted LOW, addresses presented to the device are captured in the address registers.
A
[1:0]
are also loaded into the burst counter. When ADSP and ADSC are both asserted,
only ADSP is recognized.
ZZ
Input-
Asynchronous
ZZ “sleep” Input, active HIGH
. When asserted HIGH places the device in a non-time-critical
“sleep” condition with data integrity preserved. For normal operation, this pin has to be LOW or
left floating. ZZ pin has an internal pull-down.
DQs
DQP
A,
DQP
B
I/O-
Synchronous
Bidirectional Data I/O Lines
. As inputs, they feed into an on-chip data register that is triggered
by the rising edge of CLK. As outputs, they deliver the data contained in the memory location
specified by the addresses presented during the previous clock rise of the Read cycle. The
direction of the pins is controlled by OE. When OE is asserted LOW, the pins behave as outputs.
When HIGH, DQs and DQP
[A:B]
are placed in a tri-state condition.
V
DD
Power
Supply
Power supply inputs to the core of the device
.
V
SS
Ground
Ground for the device
.
V
DDQ
I/O Power
Supply
Power supply for the I/O circuitry
.
MODE
Input-
Static
Selects Burst Order
. When tied to GND selects linear burst sequence. When tied to V
DD
or
left floating selects interleaved burst sequence. This is a strap pin and should remain static
during device operation. Mode Pin has an internal pull-up.
NC
No Connects
. Not Internally connected to the die. 4M, 9M, 18M, 72M, 144M, 288M, 576M, and
1G are address expansion pins and are not internally connected to the die.
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