xlamp xB-D leD solDering & hanDling
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc.
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Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered trademarks
of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at
www.cree.com.
after Soldering
After soldering, allow XLamp XB-D LeDs to return to room temperature before subsequent handling. Handling of the
device, especially around the lens, before cooling could result in damage to the LeD.
Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs
after reflow. This can be done by X-ray or by shearing selected devices from the circuit board. The solder should
appear completely re-flown (no solder grains evident). The solder areas should show minimum evidence of voids on the
backside of the package and the PCB.
Cleaning pCBs after Soldering
Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB
cleaning is necessary, Cree recommends the use of isopropyl alcohol (IPA).
Do not use ultrasonic cleaning.
moiSTure SenSiTiviTy
In testing, Cree has found XLamp XB-D LEDs to have unlimited floor life in conditions ≤ 30 ºC / 85% relative humidity
(RH). However, Cree recommends keeping XLamp LeDs in their sealed moisture-barrier packaging until immediately
prior to use. Cree also recommends returning any unused LeDs to the resealable moisture-barrier bag and closing the
bag immediately after use. Moisture testing included a 168-hour soak at 85 ºC / 85% RH followed by 3 reflow cycles,
with visual and electrical inspections at each stage.
