3.1 Installation method
¡
This power supply is manufactured by SMD technology.
The stress to P.C.B like twisting or bending causes the defect of
the unit,so handle the unit with care.
¡
In case of metal chassis, keep the distance between d
1
& d
2
for to
insulate between lead of component and metal chassis, use the
spacer of 8mm or more between d
1
. If it is less than d
1
& d
2
, insert
the insulation sheet between power supply and metal chassis.
3.2 Derating
¡
The operative ambient temperature is different by with / without
chassis cover or mounting position. Please refer drawings as below.
Note: In the hatched area, the specification of Ripple, Ripple
Noise is different from other area.
¿
LGA50A-3R3-Y, -5, -12, -15
¿
LGA50A-3R3-Y, -5, -12, -15 -SN
(with Chassis & Cover)
¿
LGA50A-24, -48
¿
LGA50A-24, -48 -SN (with Chassis & Cover)
¿
LGA75A
¿
LGA75A-
O
-SN (with Chassis & Cover)
¿
LGA100A
3
Assembling and
Installation Method
-10
70
60
50
40
30
1
1
2
2
Forced air (0.5m
3
/ min)
1
Convection
80
100
60
40
20
0
20
10
0
Load
factor
[%
]
[
C
]
Ambient temperature
(A)mountin
1
(E)mounting
g
(B), (C), (D)mounting
(A) ~ (F)
mounting
-10
70
60
50
40
30
1
1
2
2
1
Convection
80
100
60
40
20
0
20
10
0
Load
factor
[%
]
[
C
]
Ambient temperature
(A)mountin
1
(E)mounting
g
(B), (C), (D)mounting
(A) ~ (F)
mounting
Forced air (0.5m
3
/ min)
-10
70
60
50
40
30
1
1
2
2
Forced air (0.5m
3
/ min)
1
Convection
80
100
60
40
20
0
20
10
0
Load
factor
[%
]
[
C
]
Ambient temperature
(D)mounting
(E)mounting
(A) ~ (F)
mounting
1
1
(A)mounting
(B), (C)mounting
-10
70
60
50
40
30
2
2
1
Convection
80
100
60
40
20
0
20
10
0
Load
factor
[%
]
[
C
]
Ambient temperature
(A) ~ (F)
mounting
Forced air (0.5m
3
/ min)
1
1
(D)mounting
(E)mounting
1
(C)mounting
1
1
(A)mounting
(B)mounting
-10
70
60
50
40
30
1
1
2
2
1
Convection
80
100
60
40
20
0
20
10
0
Load
factor
[%
]
[
C
]
Ambient temperature
(A)mountin
1
(E)mounting
g
(B), (C), (D)mounting
(A) ~ (F)
mounting
Forced air (0.5m
3
/ min)
AC-DC Power Supplies Open Frame/ Enclosed Type
Instruction Manual
LGA-15
LGA
*
[F] mounting should be operated by Forced air.
*
[F] mounting should be operated by Forced air.
*
[F] mounting should be operated by Forced air.
*
[F] mounting should be operated by Forced air.
*
[F] mounting should be operated by Forced air.
Fig.3.1 Installation method
Fig.3.2 Ambient temperature derating curve
Fig.3.3 Ambient temperature derating curve
*
[F] mounting should be operated by Forced air.
*
[F] mounting should be operated by Forced air.
Fig.3.4 Ambient temperature derating curve
Fig.3.5 Ambient temperature derating curve
Fig.3.6 Ambient temperature derating curve
Fig.3.7 Ambient temperature derating curve
Fig.3.8 Ambient temperature derating curve
-10
70
60
50
40
30
1
1
2
2
Forced air (0.5m
3
/ min)
1
Convection
80
100
60
40
20
0
20
10
0
Load
factor
[%]
[
C
]
Ambient temperature
(C), (E)mounting
(D)mounting
(A) ~ (F)
mounting
1
1
(A)mounting
(B)mounting
-10
70
60
50
40
30
1
1
2
2
Forced air (0.5m
3
/ min)
1
Convection
80
100
60
40
20
0
20
10
0
Load
factor
[%]
[
C
]
Ambient temperature
(A)mounting
(B), (C), (D)mounting
1
(E) mounting
(A) ~ (F)
mounting
=
=
8mm min
4mm min
CN1
CN1
d
2
d
1
d
2
d
2
d
2
d
2
d
2
me̲lga1.indd LGA-15
me lga1 indd LGA-15
2015/06/19 14:42:26
2015/06/19 14:42:26
