7 Signal Descriptions and Pinout Tables
The following section describes the signals found on the four X connectors located on
the bottom of the module. X1, X3, and X4 connectors are ETX
®
standard compliant
while the X2 connector complies with the XTX
TM
extension specification. Table 2
describes the terminology used in this section for the Signal Description tables. The PU/
PD column indicates if a XTX
®
module pull-up or pull-down resistor has been used, if
the field entry area in this column for the signal is empty, then no pull-up or pull-down
resistor has been implemented by congatec. The “#” symbol at the end of the signal
name indicates that the active or asserted state occurs when the signal is at a low
voltage level. When “#” is not present, the signal is asserted when at a high voltage
level.
Note
The Signal Description tables do not list internal pull-ups or pull-downs implemented by
the chip vendors, only pull-ups or pull-downs implemented by congatec are listed. For
information about the internal pull-ups or pull-downs implemented by the chip vendors,
refer to the respective chip's datasheet.
Table 2
Signal Tables Terminology Descriptions
Term
Description
PU
congatec implemented pull-up resistor
PD
congatec implemented pull-down resistor
I/O 3.3V
Bi-directional signal 3.3V tolerant
I/O 5V
Bi-directional signal 5V tolerant
I 3.3V
Input 3.3V tolerant
I 5V
Input 5V tolerant
I/O 3.3VSB
Input 3.3V tolerant active in standby state
O 3.3V
Output 3.3V signal level
O 5V
Output 5V signal level
P
Power Input/Output
DDC
Display Data Channel
PCIE
In compliance with PCI Express Base Specification, Revision 1.1
SATA
In compliance with Serial ATA specification, Revision 1.0a
LVDS
Low Voltage Differential Signal-350mV nominal; 450mV maximum differential signal
TPM
Trusted Platform Module
Copyright © 2006 congatec AG
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