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3 Cooling
The conga-SBM²C module is designed to meet the latest efficiency standards and
requirements therefore the produced power dissipation is minimal. To be able to use the
module in a wide temperature range, it is recommended that you attach some form of a
cooling solution to the module.
The back of conga-SBM²C does not contain any components and is designed so that
the module can be attached to the system chassis or a heatsink using thermal
conductive gap filler pads.
You can use for example:
•
Chomerics THERM-A-GAP:
http://www.chomerics.com
•
T-Global L37 series
http://www.tglobal.com.tw/
•
Bergquist Gap-Pad
http://www.bergquistcompany.com
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