Congatec conga-IA3, Руководство пользователя

Страница: 16 / 82

Copyright © 2015 congatec AG IA30m10 16/82
4 Cooling Solution
The conga-IA3 SBC offers Ultra Low Power boards with high computing performance and outstanding graphics. Due to its low power
consumption, the SBC generates less heat and therefore requires less active cooling, allowing the use of quieter, lower profile coolers that are
better suited to small form factor systems.
Nonetheless, all electronics contain semiconductor devices which have operating temperature ranges that should be adhered to. This means
that for reliable operation, the thermal design of the conga-IA3 must be carefully considered. For this reason, it is imperative to provide
sufficient air flow to each of the components, to ensure the specified operating temperature of the conga-IA3 is maintained.
congatec AG offers two cooling possibilities for the conga-IA3:
•
A congatec heatspreader in combination with the conga-IA3 retention frame. This cooling solution is adapted to the Thin Mini-ITX
height specification and features a Hi-Flow 225UT pressure sensitive, phase change thermal interface. Refer to section 4.2 “Heatspreader
Dimensions” for the dimensions of the congatec heatspreader.
• The use of a custom cooling solution in combination with the conga-IA3 retention frame.
Note
When a passive cooling is used, the end user must ensure that adequate air flow is maintained.
See section 1.2.2 “Optional Accessories/Cables” for the part numbers of the cooling accessories.
Heatspreader
Retention Frame